Dirk Siepe

Person

Dortmund, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor arrangement, semiconductor module, and method for con...
- Patent number 9,196,562
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for operating a power semicon...
- Patent number 9,129,934
- Issue date Sep 8, 2015
- Infineon Technologies AG
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a bond
- Patent number 8,955,219
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Roman Roth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding connection between a bonding wire and a power semiconductor...
- Patent number 8,541,892
- Issue date Sep 24, 2013
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 8,198,721
- Issue date Jun 12, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 8,164,176
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a power device with first metal laye...
- Patent number 7,851,913
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Thomas Gutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, device and system for bonding a semiconductor element
- Patent number 7,654,434
- Issue date Feb 2, 2010
- Infineon Technologies AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for producing a bonding connection
- Patent number 7,597,235
- Issue date Oct 6, 2009
- Infineon Technologies AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Arrangement, Semiconductor Module, and Method for Con...
- Publication number 20110316160
- Publication date Dec 29, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Connection Between a Bonding Wire and a Power Semiconductor...
- Publication number 20110121458
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method for Operating a Power Semicon...
- Publication number 20110115068
- Publication date May 19, 2011
- INFINEON TECHNOLOGIES AG
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Bond
- Publication number 20100212153
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PRODUCING A BONDING CONNECTION
- Publication number 20090127316
- Publication date May 21, 2009
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION
- Publication number 20090127317
- Publication date May 21, 2009
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor arrangement, semiconductor module, and method for con...
- Publication number 20080093729
- Publication date Apr 24, 2008
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, method for producing it, and method for pr...
- Publication number 20070013046
- Publication date Jan 18, 2007
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method, Device and System for Bonding a Semiconductor Element
- Publication number 20060208037
- Publication date Sep 21, 2006
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Miniaturized analytical system
- Publication number 20050077175
- Publication date Apr 14, 2005
- Friedhelm Eisenbeiss
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Person

Patents Grantslast 30 patents

Semiconductor arrangement, semiconductor module, and method for con...

Power semiconductor module and method for operating a power semicon...

Method for fabricating a bond

Bonding connection between a bonding wire and a power semiconductor...

Semiconductor module

Semiconductor module arrangement

Semiconductor device including a power device with first metal laye...

Method, device and system for bonding a semiconductor element

Apparatus and method for producing a bonding connection

Patents Applicationslast 30 patents

Semiconductor Arrangement, Semiconductor Module, and Method for Con...

Bonding Connection Between a Bonding Wire and a Power Semiconductor...

Power Semiconductor Module and Method for Operating a Power Semicon...

Method for Fabricating a Bond

APPARATUS AND METHOD FOR PRODUCING A BONDING CONNECTION

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

Semiconductor arrangement, semiconductor module, and method for con...

Semiconductor substrate, method for producing it, and method for pr...

Method, Device and System for Bonding a Semiconductor Element

Miniaturized analytical system