Dirk Tobben

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits and manufacturing methods
- Patent number 6,492,282
- Issue date Dec 10, 2002
- Siemens Aktiengesellschaft
- Dirk Tobben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor fuse
- Patent number 6,261,937
- Issue date Jul 17, 2001
- Siemens Aktiengesellschaft
- Dirk Többen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and manufacturing methods
- Patent number 6,245,629
- Issue date Jun 12, 2001
- Infineon Technologies North America Corp.
- Dirk Tobben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance DRAM and method of manufacture
- Patent number 6,235,574
- Issue date May 22, 2001
- Infineon North America Corp.
- Dirk Többen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of controlled trench top isolation layers for vertical tr...
- Patent number 6,184,091
- Issue date Feb 6, 2001
- Infineon Technologies North America Corp.
- Ulrike Gruening
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of controlled trench top isolation layers for vertical tr...
- Patent number 6,177,698
- Issue date Jan 23, 2001
- Infineon Technologies North America Corp.
- Ulrike Gruening
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of photoresist poisoning from dielectric antireflective...
- Patent number 6,103,456
- Issue date Aug 15, 2000
- Siemens Aktiengesellschaft
- Dirk Tobben
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Dual damascene process for metal layers and organic intermetal layers
- Patent number 6,066,569
- Issue date May 23, 2000
- Siemens Aktiengesellschaft
- Dirk Tobben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalization system having an enhanced thermal conductivity
- Patent number 6,046,503
- Issue date Apr 4, 2000
- Siemens Aktiengesellschaft
- Peter Weigand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a conductive fuse and process for...
- Patent number 6,037,648
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Kenneth C. Arndt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene structure
- Patent number 6,033,977
- Issue date Mar 7, 2000
- Siemens Aktiengesellschaft
- Martin Gutsche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstructure and methods for fabricating such structure
- Patent number 6,015,988
- Issue date Jan 18, 2000
- Siemens Aktiengesellschaft
- Dirk Tobben
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planarization of a non-conformal device layer in semiconductor fabr...
- Patent number 6,001,740
- Issue date Dec 14, 1999
- Siemens Aktiengesellschaft
- Kathryn H. Varian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level conductive structure including low capacitance material
- Patent number 5,977,635
- Issue date Nov 2, 1999
- Siemens Aktiengesellschaft
- Dirk Tobben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing the semiconductor structure
- Patent number 5,963,837
- Issue date Oct 5, 1999
- Siemens Aktiengesellschaft
- Matthias Ilg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a structure
- Patent number 5,926,716
- Issue date Jul 20, 1999
- Siemens Aktiengesellschaft
- Dirk Tobben
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Techniques for forming electrically blowable fuses on an integrated...
- Patent number 5,899,736
- Issue date May 4, 1999
- Siemens Aktiengesellschaft
- Peter Weigand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of a non-conformal device layer in semiconductor fabr...
- Patent number 5,880,007
- Issue date Mar 9, 1999
- Siemens Aktiengesellschaft
- Kathryn H. Varian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metallization in semiconductor devices with a se...
- Patent number 5,854,126
- Issue date Dec 29, 1998
- Siemens Aktiengesellschaft
- Dirk Tobben
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR EXPANDING TRENCHES BY AN ANISOTROPIC WET ETCH
- Publication number 20010016398
- Publication date Aug 23, 2001
- STEPHAN KUDELKA
- H01 - BASIC ELECTRIC ELEMENTS

Dirk Tobben

Person

Patents Grantslast 30 patents

Integrated circuits and manufacturing methods

Method for forming a semiconductor fuse

Semiconductor structures and manufacturing methods

High performance DRAM and method of manufacture

Formation of controlled trench top isolation layers for vertical tr...

Formation of controlled trench top isolation layers for vertical tr...

Prevention of photoresist poisoning from dielectric antireflective...

Dual damascene process for metal layers and organic intermetal layers

Metalization system having an enhanced thermal conductivity

Semiconductor structure including a conductive fuse and process for...

Dual damascene structure

Microstructure and methods for fabricating such structure

Planarization of a non-conformal device layer in semiconductor fabr...

Multi-level conductive structure including low capacitance material

Method of planarizing the semiconductor structure

Method for forming a structure

Techniques for forming electrically blowable fuses on an integrated...

Planarization of a non-conformal device layer in semiconductor fabr...

Method for forming metallization in semiconductor devices with a se...

Patents Applicationslast 30 patents

METHOD FOR EXPANDING TRENCHES BY AN ANISOTROPIC WET ETCH