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Dolores Babaran Milo

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  • Baguio City, PH
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LEAD FRAME FOR A DIE
    • Publication number 20250022776
    • Publication date Jan 16, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran MILO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Alternating Lead Configuration for Semiconductor Package
    • Publication number 20250006599
    • Publication date Jan 2, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores P. Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
    • Publication number 20230352441
    • Publication date Nov 2, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE ATTACH ADHESIVE-READY LEAD FRAME DESIGN
    • Publication number 20230197575
    • Publication date Jun 22, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • John Carlo Molina
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT FOR IC PACKAGE
    • Publication number 20230170285
    • Publication date Jun 1, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Ruby Ann Merto Camenforte
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEADFRAME WITH GROUND PAD CANTILEVER
    • Publication number 20230129297
    • Publication date Apr 27, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Ernesto Pentecostes Rafael
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT HAVING MICRO-ETCHED CHANNELS
    • Publication number 20230054963
    • Publication date Feb 23, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE WITH CONCAVE LEAD END FACES
    • Publication number 20220359352
    • Publication date Nov 10, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SPLIT TIE BAR FOR CLIP STABILITY
    • Publication number 20220344302
    • Publication date Oct 27, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TWO SIDED BONDABLE LEAD FRAME
    • Publication number 20220157700
    • Publication date May 19, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DIE SINGULATION
    • Publication number 20210249306
    • Publication date Aug 12, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Connie Alagadan Esteron
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE WITH SHIFTED LEAD NECK
    • Publication number 20210202365
    • Publication date Jul 1, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SELECTIVE MOLDING FOR INTEGRATED CIRCUIT
    • Publication number 20210111086
    • Publication date Apr 15, 2021
    • Texas Instruments Incorporated
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEADFRAME WITH GROUND PAD CANTILEVER
    • Publication number 20210104471
    • Publication date Apr 8, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Ernesto Pentecostes Rafael
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DIE SINGULATION
    • Publication number 20210043512
    • Publication date Feb 11, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Connie Alagadan Esteron
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SIDERAIL WITH MOLD COMPOUND RELIEF
    • Publication number 20200235043
    • Publication date Jul 23, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE WITH GROOVED SUBSTRATE
    • Publication number 20200194350
    • Publication date Jun 18, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran MILO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TRANSPORT PACKAGING AND METHOD FOR EXPANDED WAFERS
    • Publication number 20200083076
    • Publication date Mar 12, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Connie Alagadan Esteron
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEAD FRAME FOR A DIE
    • Publication number 20200043833
    • Publication date Feb 6, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran MILO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE WITH GROOVED SUBSTRATE
    • Publication number 20190393138
    • Publication date Dec 26, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran MILO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TWO SIDED BONDABLE LEAD FRAME
    • Publication number 20190355651
    • Publication date Nov 21, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    QFN PIN ROUTING THRU LEAD FRAME ETCHING
    • Publication number 20190348302
    • Publication date Nov 14, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran MILO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    QFN PIN ROUTING THRU LEAD FRAME ETCHING
    • Publication number 20180182642
    • Publication date Jun 28, 2018
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran MILO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT (IC) CHIP SOCKET
    • Publication number 20180159259
    • Publication date Jun 7, 2018
    • TEXAS INSTRUMENTS INCORPORATED
    • DOLORES BABARAN MILO
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    AIR BLOW FOR SEMICONDUCTOR WAFERS IN A VACUUM SEMICONDUCTOR WAFER L...
    • Publication number 20180076072
    • Publication date Mar 15, 2018
    • TEXAS INSTRUMENTS INCORPORATED
    • Connie Alagadan ESTERON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...
    • Publication number 20170278776
    • Publication date Sep 28, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • Dolores Babaran Milo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BGA SPRING PROBE PIN DESIGN
    • Publication number 20170237192
    • Publication date Aug 17, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Flores Milo
    • H01 - BASIC ELECTRIC ELEMENTS