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Dominic Maier
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Pleystein, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Emitter package for a photoacoustic sensor
Patent number
11,609,180
Issue date
Mar 21, 2023
Infineon Technologies AG
Siyuan Qi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS sensor, MEMS sensor system and method for producing a MEMS sen...
Patent number
11,492,249
Issue date
Nov 8, 2022
Infineon Technologies AG
David Tumpold
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Device and method for debonding a structure from a main surface reg...
Patent number
11,279,120
Issue date
Mar 22, 2022
Infineon Technologies AG
Alfred Sigi
B32 - LAYERED PRODUCTS
Information
Patent Grant
System and method for a transducer in an EWLB package
Patent number
11,211,298
Issue date
Dec 28, 2021
Infineon Technologies AG
Stephan Pindl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including an antenna
Patent number
11,195,787
Issue date
Dec 7, 2021
Infineon Technologies AG
Ngoc-Hoa Huynh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
11,040,872
Issue date
Jun 22, 2021
Infineon Technologies AG
Claus Waechter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device including a cavity lid
Patent number
10,626,012
Issue date
Apr 21, 2020
Infineon Technologies AG
Franz-Xaver Muehlbauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for handling a product substrate and a bonded substrate system
Patent number
10,600,690
Issue date
Mar 24, 2020
Infineon Technologies AG
Georg Meyer-Berg
B32 - LAYERED PRODUCTS
Information
Patent Grant
Semiconductor package with a through port for sensor applications
Patent number
10,549,985
Issue date
Feb 4, 2020
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
System and method for a transducer in an eWLB package
Patent number
10,546,752
Issue date
Jan 28, 2020
Infineon Technologies AG
Stephan Pindl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a semiconductor module
Patent number
10,435,292
Issue date
Oct 8, 2019
Infineon Technologies AG
Claus Waechter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
System and method for a transducer in an eWLB package
Patent number
10,186,468
Issue date
Jan 22, 2019
Infineon Technologies AG
Stephan Pindl
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus for determining a characteristic of a fluid having a devi...
Patent number
10,161,908
Issue date
Dec 25, 2018
Infineon Technologies AG
Rui Miguel Moreira Araujo
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method for handling a product substrate, a bonded substrate system...
Patent number
10,056,295
Issue date
Aug 21, 2018
Infineon Technologies AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temporary mechanical stabilization of semiconductor cavities
Patent number
9,988,262
Issue date
Jun 5, 2018
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Chip package and a method of producing the same
Patent number
9,981,843
Issue date
May 29, 2018
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of packaging integrated circuits
Patent number
9,806,056
Issue date
Oct 31, 2017
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a MEMS die and a conductive layer
Patent number
9,725,303
Issue date
Aug 8, 2017
Infineon Technologies AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Package arrangement including external block comprising semiconduct...
Patent number
9,711,462
Issue date
Jul 18, 2017
Infineon Technologies AG
Gottfried Beer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of packaging integrated circuits and a molded package
Patent number
9,487,392
Issue date
Nov 8, 2016
Infineon Technologies AG
Ulrich Wachter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic component
Patent number
9,368,435
Issue date
Jun 14, 2016
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal redistribution layer for molded substrates
Patent number
9,275,878
Issue date
Mar 1, 2016
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a plurality of semiconductor devices
Patent number
9,147,585
Issue date
Sep 29, 2015
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded semiconductor package with backside die metallization
Patent number
9,099,454
Issue date
Aug 4, 2015
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical measurement based circuit wiring layout modification met...
Patent number
8,990,744
Issue date
Mar 24, 2015
Infineon Technologies AG
Gottfried Beer
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device
Patent number
8,890,284
Issue date
Nov 18, 2014
Infineon Technologies AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of packaging integrated circuits and a molded substrate with...
Patent number
8,828,807
Issue date
Sep 9, 2014
Infineon Technologies AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device including an encapsulated semiconductor chip and manufacturi...
Patent number
8,421,226
Issue date
Apr 16, 2013
Infineon Technologies AG
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MONOLITHIC SOUND TRANSDUCER AND ENVIRONMENTAL BARRIER
Publication number
20240187770
Publication date
Jun 6, 2024
INFINEON TECHNOLOGIES AG
Hutomo Suryo Wasisto
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PRESSURE TRANSDUCER DEVICE WITH HYBRID BARRIER STRUCTURE AND METHOD...
Publication number
20240182295
Publication date
Jun 6, 2024
INFINEON TECHNOLOGIES AG
Hutomo Suryo Wasisto
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROMECHANICAL ENVIRONMENTAL BARRIER DEVICE
Publication number
20240182297
Publication date
Jun 6, 2024
INFINEON TECHNOLOGIES AG
Hutomo Suryo Wasisto
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHEMO-RESISTIVE GAS SENSING DEVICE COMPRISING A CATALYTIC GAS FILTE...
Publication number
20240060944
Publication date
Feb 22, 2024
INFINEON TECHNOLOGIES AG
Alexandra Marina Roth
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
Publication number
20220148951
Publication date
May 12, 2022
INFINEON TECHNOLOGIES AG
Ngoc-Hoa Huynh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Emitter Package for a Photoacoustic Sensor
Publication number
20210172862
Publication date
Jun 10, 2021
INFINEON TECHNOLOGIES AG
Siyuan Qi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SYSTEM AND METHOD FOR A TRANSDUCER IN AN EWLB PACKAGE
Publication number
20200051824
Publication date
Feb 13, 2020
INFINEON TECHNOLOGIES AG
Stephan Pindl
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
Publication number
20200039820
Publication date
Feb 6, 2020
INFINEON TECHNOLOGIES AG
Claus Waechter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
DEVICE AND METHOD FOR DEBONDING A STRUCTURE FROM A MAIN SURFACE REG...
Publication number
20200023630
Publication date
Jan 23, 2020
INFINEON TECHNOLOGIES AG
Alfred Sigl
B32 - LAYERED PRODUCTS
Information
Patent Application
MEMS SENSOR, MEMS SENSOR SYSTEM AND METHOD FOR PRODUCING A MEMS SEN...
Publication number
20190352175
Publication date
Nov 21, 2019
INFINEON TECHNOLOGIES AG
David Tumpold
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
System and Method for a Transducer in an eWLB Package
Publication number
20190148253
Publication date
May 16, 2019
INFINEON TECHNOLOGIES AG
Stephan Pindl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR DETERMINING A CHARACTERISTIC OF A FLUID HAVING A DEVI...
Publication number
20190079055
Publication date
Mar 14, 2019
INFINEON TECHNOLOGIES AG
Rui Miguel Moreira Araujo
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Method for Handling a Product Substrate and a Bonded Substrate System
Publication number
20180350683
Publication date
Dec 6, 2018
INFINEON TECHNOLOGIES AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
Publication number
20180148322
Publication date
May 31, 2018
INFINEON TECHNOLOGIES AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES
Publication number
20180086632
Publication date
Mar 29, 2018
INFINEON TECHNOLOGIES AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
Publication number
20180022601
Publication date
Jan 25, 2018
INFINEON TECHNOLOGIES AG
Claus Waechter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
System and Method for a Transducer in an eWLB Package
Publication number
20170284951
Publication date
Oct 5, 2017
INFINEON TECHNOLOGIES AG
Stephan Pindl
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE
Publication number
20170283247
Publication date
Oct 5, 2017
INFINEON TECHNOLOGIES AG
Thorsten Meyer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Apparatus for Determining a Characteristic of a Fluid
Publication number
20170276646
Publication date
Sep 28, 2017
INFINEON TECHNOLOGIES AG
Rui Miguel Moreira Araujo
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
Publication number
20170236776
Publication date
Aug 17, 2017
INFINEON TECHNOLOGIES AG
Ngoc-Hoa Huynh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Package and a Method of Producing the Same
Publication number
20160311679
Publication date
Oct 27, 2016
INFINEON TECHNOLOGIES AG
Dominic Maier
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CAVITY LID
Publication number
20160297672
Publication date
Oct 13, 2016
INFINEON TECHNOLOGIES AG
Franz-Xaver Muehlbauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method for Handling a Product Substrate, a Bonded Substrate System...
Publication number
20160218039
Publication date
Jul 28, 2016
INFINEON TECHNOLOGIES AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Packaging Integrated Circuits
Publication number
20160163674
Publication date
Jun 9, 2016
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component
Publication number
20160086876
Publication date
Mar 24, 2016
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal Redistribution Layer for Molded Substrates
Publication number
20150091171
Publication date
Apr 2, 2015
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device
Publication number
20150064846
Publication date
Mar 5, 2015
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded Semiconductor Package with Backside Die Metallization
Publication number
20150041967
Publication date
Feb 12, 2015
INFINEON TECHNOLOGIES AG
Ulrich Wachter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Packaging Integrated Circuits and a Molded Package
Publication number
20150028435
Publication date
Jan 29, 2015
INFINEON TECHNOLOGIES AG
Ulrich Wachter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME
Publication number
20140332936
Publication date
Nov 13, 2014
INFINEON TECHNOLOGIES AG
Gottfried Beer
H01 - BASIC ELECTRIC ELEMENTS