Dominik Suwito

Person

San Jose, CA, US

People

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID THERMAL PROCESSING FOR DIRECT BONDING
- Publication number 20240079376
- Publication date Mar 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Dominik Suwito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20230140107
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING THIN SUBSTRATES
- Publication number 20230115122
- Publication date Apr 13, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING AND DEBONDING OF CARRIER
- Publication number 20220319901
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Dominik Suwito
- H01 - BASIC ELECTRIC ELEMENTS

Dominik Suwito

Person

Patents Applicationslast 30 patents

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

DEBONDING REPAIR DEVICES

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

RAPID THERMAL PROCESSING FOR DIRECT BONDING

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

DIRECT BONDING METHODS AND STRUCTURES

METHOD OF BONDING THIN SUBSTRATES

DIRECT BONDING AND DEBONDING OF CARRIER