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Donald Almen
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San Martin, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Assembly having stacked die mounted on substrate
Patent number
8,729,690
Issue date
May 20, 2014
Invensas Corporation
Al Vindasius
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly having stacked die mounted on substrate
Patent number
8,357,999
Issue date
Jan 22, 2013
Vertical Circuits (Assignment for the Benefit of Creditors), LLC
Marc E. Robinson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die assembly having electrical interconnect
Patent number
7,535,109
Issue date
May 19, 2009
Vertical Circuits, Inc.
Marc E. Robinson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micropede stacked die component assembly
Patent number
7,245,021
Issue date
Jul 17, 2007
Vertical Circuits, Inc.
Al Vindasius
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die BGA or LGA component assembly
Patent number
7,215,018
Issue date
May 8, 2007
Vertical Circuits, Inc.
Al Vindasius
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ASSEMBLY HAVING STACKED DIE MOUNTED ON SUBSTRATE
Publication number
20130207249
Publication date
Aug 15, 2013
Invensas Corporation
Al Vindasius
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Assembly Having Stacked Die Mounted On Substrate
Publication number
20070284716
Publication date
Dec 13, 2007
Vertical Circuits, Inc.
Al Vindasius
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Assembly Having Electrical Interconnect
Publication number
20070252262
Publication date
Nov 1, 2007
Vertical Circuits, Inc.
Marc Robinson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Micropede stacked die component assembly
Publication number
20050258530
Publication date
Nov 24, 2005
Al Vindasius
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked die BGA or LGA component assembly
Publication number
20050230802
Publication date
Oct 20, 2005
Al Vindasius
H01 - BASIC ELECTRIC ELEMENTS