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Donald S. Fritz
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Thermally enhanced metal capped BGA package
Patent number
7,319,051
Issue date
Jan 15, 2008
Altera Corporation
Eng C. Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and material for assembling a low-K Si die to achieve a l...
Patent number
7,144,756
Issue date
Dec 5, 2006
Altera Corporation
Wen-Chou Vincent Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with stress inhibiting intermediate mounting...
Patent number
6,969,636
Issue date
Nov 29, 2005
Altera Corporation
Donald S. Fritz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip package with warpage control
Patent number
6,949,404
Issue date
Sep 27, 2005
Altera Corporation
Don Fritz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and material for assembling a low-K Si die to achieve a l...
Patent number
6,909,176
Issue date
Jun 21, 2005
Altera Corporation
Wen-Chou Vincent Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced metal capped BGA package
Patent number
6,882,041
Issue date
Apr 19, 2005
Altera Corporation
Eng C. Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with stress inhibiting intermediate mounting...
Patent number
6,734,540
Issue date
May 11, 2004
Altera Corporation
Donald S. Fritz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package
Patent number
5,757,070
Issue date
May 26, 1998
Altera Corporation
Donald S. Fritz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package fabrication method
Patent number
5,744,383
Issue date
Apr 28, 1998
Altera Corporation
Donald S. Fritz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Thermally enhanced metal capped BGA package
Publication number
20050179125
Publication date
Aug 18, 2005
Altera Corporation
Eng C. Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and structure for integrated circuit package
Publication number
20020145207
Publication date
Oct 10, 2002
Sidney Larry Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package with stress inhibiting intermediate mounting...
Publication number
20020041489
Publication date
Apr 11, 2002
Donald S. Fritz
H01 - BASIC ELECTRIC ELEMENTS