Corporate Profile, Shinko Electric Industries Co., Ltd., Nagano-Shi, Japan (undated). |
"Tape Automated Bonding (TAB), Preliminary Data, Family Code: TP7," Technology Products, IBM, Armonk, New York, Jan. 11, 1993. |
"Area Array TAB Packaging (ATAB), Preliminary Data, Family Code: TP7," Technology Products, IBM, Armonk, New York, Jan. 13, 1993. |
"C-4 Solder Chip Connection, Preliminary Data," Technology Products, IBM, Armonk, New York, Jan. 8, 1993. |
"TAB Interposer Enables Dramatic Die Cost Reduction Using Standard Packages," Swire Technologies, Hong Kong (undated). |
"Solder Bumping Flow," APTOS Corporation, Milpitas, California (undated). |
"Wafer Bumping Service," Brochure of APTOS Corporation, Milpitas, California (undated). |
"Standard Procedures and Practices," JEDEC Standard 95-1, pp. 3-7 to 3-10, Jun. 20, 1991. |
"Metric Plastic Quad Flat Pack Family 3.2mm Footprint," JEDEC Publication No. 95, JEDEC Solid State Product Outlines, Issue A, pp. 1-24, Oct., 1990. |
"TapePak.RTM. Molded Carrier Ring Family," JEDEC Solid State Product Outlines, Issue B, pp. 1 and 2, Mar., 1993. |
"Metric Tape Automated Bonding (TAB) Tape Carrier Family," JEDEC Solid State Product Outline, Issue A, pp. 1-10, Nov., 1993. |
"Tape Automated Bonding (TAB) Package Family (S-PQUC-X/TAB)," JEDEC Solid State Product Outline, Issue B, pp. 1-23, Nov., 1993. |