Dong-Ho Han

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic interference shields having attentuation interfaces
- Patent number 12,133,322
- Issue date Oct 29, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic computing device having self-shielding antenna
- Patent number 12,074,368
- Issue date Aug 27, 2024
- Intel Corporation
- Denica Larsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-level noise filtering for EMI RFI mitigation
- Patent number 11,804,454
- Issue date Oct 31, 2023
- Tahoe Research, LTD.
- Hao-Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge substrate having an integral device
- Patent number 11,749,606
- Issue date Sep 5, 2023
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to provide electrical shielding for integrate...
- Patent number 11,616,000
- Issue date Mar 28, 2023
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for dynamically avoiding radio frequency interf...
- Patent number 11,558,158
- Issue date Jan 17, 2023
- Intel Corporation
- Michael Shusterman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stiffener and package substrate for a semiconductor package
- Patent number 11,295,998
- Issue date Apr 5, 2022
- Intel Corporation
- Stephen Christianson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge substrate having an integral device
- Patent number 11,133,256
- Issue date Sep 28, 2021
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation shield around a component on a substrate
- Patent number 11,081,450
- Issue date Aug 3, 2021
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-level noise filtering for EMI RFI mitigation
- Patent number 10,991,665
- Issue date Apr 27, 2021
- Intel Corporation
- Hao-Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-low profile package shielding technique using magnetic and co...
- Patent number 10,950,555
- Issue date Mar 16, 2021
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference (EMI) shield for a printed circuit boa...
- Patent number 10,645,797
- Issue date May 5, 2020
- Intel Corporation
- Dong-Ho Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ground layer design in a printed circuit board (PCB)
- Patent number 10,454,163
- Issue date Oct 22, 2019
- Intel Corporation
- JaeJin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with attenuated electromagnetic interfer...
- Patent number 10,403,581
- Issue date Sep 3, 2019
- Intel Corporation
- Jaejin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch-based proximity sensors, antennas, and control systems to con...
- Patent number 9,705,182
- Issue date Jul 11, 2017
- Intel Corporation
- Hao-Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pair differential lines printed circuit board common mode filter
- Patent number 9,544,991
- Issue date Jan 10, 2017
- Intel Corporation
- Chung-Hao J. Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid radio frequency component
- Patent number 9,251,984
- Issue date Feb 2, 2016
- Intel Corporation
- Hao-Han Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Edge-emitting antennas for ultra slim wireless mobile devices
- Patent number 8,907,859
- Issue date Dec 9, 2014
- Intel Corporation
- Hao-Han Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package with chip-side signal connections
- Patent number 7,611,924
- Issue date Nov 3, 2009
- Intel Corporation
- Joong-Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line impedance matching
- Patent number 7,432,779
- Issue date Oct 7, 2008
- Intel Corporation
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical capacitor apparatus, systems, and methods
- Patent number 7,352,557
- Issue date Apr 1, 2008
- Intel Corporation
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with chip-side signal connections
- Patent number 7,345,359
- Issue date Mar 18, 2008
- Intel Corporation
- Joong-Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line impedance matching
- Patent number 7,218,183
- Issue date May 15, 2007
- Intel Corporation
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line impedance matching
- Patent number 7,142,073
- Issue date Nov 28, 2006
- Intel Corporation
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reference slots for signal traces
- Patent number 7,110,263
- Issue date Sep 19, 2006
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical capacitor apparatus, systems, and methods
- Patent number 6,885,544
- Issue date Apr 26, 2005
- Intel Corporation
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power and ground connectors for socket
- Patent number 6,877,998
- Issue date Apr 12, 2005
- Intel Corporation
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TRANSMIT POWER CONTROL FOR DMRS BUNDLING FOR COVERAGE ENHANCEMENT
- Publication number 20250048272
- Publication date Feb 6, 2025
- Intel Corporation
- Gang Xiong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
UPLINK CONTROL INFORMATION (UCI) MULTIPLEXING FOR MULTI-TRANSMISSIO...
- Publication number 20240260027
- Publication date Aug 1, 2024
- Intel Corporation
- Dong Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF PERFORMANCE MONITORING FOR CSI PREDICTION
- Publication number 20240250766
- Publication date Jul 25, 2024
- Viktor Sergeev
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ENHANCED UPLINK TRANSMISSION USING MULTIPLE CODEWORDS
- Publication number 20240244595
- Publication date Jul 18, 2024
- Intel Corporation
- Guotong WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SINGLE TRP AND MULTIPLE TRP DYNAMIC SWITCHING FOR SINGLE DCI BASED...
- Publication number 20240187172
- Publication date Jun 6, 2024
- Intel Corporation
- Alexei Davydov
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS AND APPARATUS FOR POWER HEADROOM REPORTING FOR MULTIPLE TRA...
- Publication number 20240188005
- Publication date Jun 6, 2024
- Intel Corporation
- Dong HAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TECHNIQUES FOR MULTI-TRANSMISSION-RECEPTION POINT (TRP) BASED UPLIN...
- Publication number 20240178939
- Publication date May 30, 2024
- Intel Corporation
- Alexei Davydov
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SINGLE-DCI-BASED PHYSICAL UPLINK SHARED CHANNEL (PUSCH) TRANSMISSIO...
- Publication number 20240163900
- Publication date May 16, 2024
- Intel Corporation
- Alexei Davydov
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONFIGURATION OF MULTIPLE COMPONENT CARRIER REPETITION TRANSMISSIONS
- Publication number 20240155607
- Publication date May 9, 2024
- Intel Corporation
- Dong Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TECHNIQUES FOR UPLINK (UL) SIMULTANEOUS TRANSMISSION ACROSS MULTI-P...
- Publication number 20230388997
- Publication date Nov 30, 2023
- Bishwarup Mondal
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISTRIBUTED RADIOHEAD SYSTEM
- Publication number 20230361802
- Publication date Nov 9, 2023
- Intel Corporation
- Jayprakash THAKUR
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
UNIFIED TRANSMISSION CONFIGURATION INDICATOR (TCI) FRAMEWORK FOR MU...
- Publication number 20230269057
- Publication date Aug 24, 2023
- Intel Corporation
- Avik Sengupta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RADIO FREQUENCY INTERFERENCE (RFI) SHIELDED SUBSTRATE-INTEGRATED-WA...
- Publication number 20230187839
- Publication date Jun 15, 2023
- Intel Corporation
- Seong-Youp John Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST SURFACE MOUNT EMI GASKETS
- Publication number 20230016486
- Publication date Jan 19, 2023
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM CHASSIS DESIGN FOR NOISE ISOLATION AND THERMAL AIR...
- Publication number 20220394884
- Publication date Dec 8, 2022
- Intel Corporation
- Kwan Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic computing device having self-shielding antenna
- Publication number 20220294109
- Publication date Sep 15, 2022
- Denica LARSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED GRID ARRAY MODULE
- Publication number 20220272880
- Publication date Aug 25, 2022
- Intel Corporation
- Shailendra Singh CHAUHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR DYNAMICALLY AVOIDING RADIO FREQUENCY INTERF...
- Publication number 20220150006
- Publication date May 12, 2022
- Intel Corporation
- Michael SHUSTERMAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE
- Publication number 20210335712
- Publication date Oct 28, 2021
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO PROVIDE ELECTRICAL SHIELDING FOR INTEGRATE...
- Publication number 20210327782
- Publication date Oct 21, 2021
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-LEVEL NOISE FILTERING FOR EMI RFI MITIGATION
- Publication number 20210193598
- Publication date Jun 24, 2021
- Intel Corporation
- Hao-Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDS HAVING ATTENTUATION INTERFACES
- Publication number 20210120665
- Publication date Apr 22, 2021
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-LEVEL NOISE FILTERING FOR EMI RFI MITIGATION
- Publication number 20200066658
- Publication date Feb 27, 2020
- Intel Corporation
- Hao-Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE
- Publication number 20200027844
- Publication date Jan 23, 2020
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-LOW PROFILE PACKAGE SHIELDING TECHNIQUE USING MAGNETIC AND CO...
- Publication number 20190393165
- Publication date Dec 26, 2019
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE
- Publication number 20190311963
- Publication date Oct 10, 2019
- Intel Corporation
- Stephen CHRISTIANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE
- Publication number 20190304915
- Publication date Oct 3, 2019
- Intel Corporation
- Amit Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH ATTENUATED ELECTROMAGNETIC INTERFER...
- Publication number 20190103366
- Publication date Apr 4, 2019
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUND LAYER DESIGN IN A PRINTED CIRCUIT BOARD (PCB)
- Publication number 20190097313
- Publication date Mar 28, 2019
- Intel Corporation
- JaeJin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SODIMM CONNECTOR SHIELD TO REDUCE RADIO FREQUENCY INTERFERENCE (RFI)
- Publication number 20190044289
- Publication date Feb 7, 2019
- Intel Corporation
- XIANG LI
- H01 - BASIC ELECTRIC ELEMENTS

Dong-Ho Han

Person

Patents Grantslast 30 patents

Electromagnetic interference shields having attentuation interfaces

Electronic computing device having self-shielding antenna

Package-level noise filtering for EMI RFI mitigation

Embedded bridge substrate having an integral device

Methods and apparatus to provide electrical shielding for integrate...

Methods and devices for dynamically avoiding radio frequency interf...

Stiffener and package substrate for a semiconductor package

Embedded bridge substrate having an integral device

Radiation shield around a component on a substrate

Package-level noise filtering for EMI RFI mitigation

Ultra-low profile package shielding technique using magnetic and co...

Electromagnetic interference (EMI) shield for a printed circuit boa...

Ground layer design in a printed circuit board (PCB)

Electronic device packages with attenuated electromagnetic interfer...

Patch-based proximity sensors, antennas, and control systems to con...

Multi-pair differential lines printed circuit board common mode filter

Hybrid radio frequency component

Edge-emitting antennas for ultra slim wireless mobile devices

Integrated circuit package with chip-side signal connections

Transmission line impedance matching

Vertical capacitor apparatus, systems, and methods

Integrated circuit package with chip-side signal connections

Transmission line impedance matching

Transmission line impedance matching

Reference slots for signal traces

Vertical capacitor apparatus, systems, and methods

Power and ground connectors for socket

Patents Applicationslast 30 patents

TRANSMIT POWER CONTROL FOR DMRS BUNDLING FOR COVERAGE ENHANCEMENT

UPLINK CONTROL INFORMATION (UCI) MULTIPLEXING FOR MULTI-TRANSMISSIO...

METHOD OF PERFORMANCE MONITORING FOR CSI PREDICTION

ENHANCED UPLINK TRANSMISSION USING MULTIPLE CODEWORDS

SINGLE TRP AND MULTIPLE TRP DYNAMIC SWITCHING FOR SINGLE DCI BASED...

METHODS AND APPARATUS FOR POWER HEADROOM REPORTING FOR MULTIPLE TRA...

TECHNIQUES FOR MULTI-TRANSMISSION-RECEPTION POINT (TRP) BASED UPLIN...

SINGLE-DCI-BASED PHYSICAL UPLINK SHARED CHANNEL (PUSCH) TRANSMISSIO...

CONFIGURATION OF MULTIPLE COMPONENT CARRIER REPETITION TRANSMISSIONS

TECHNIQUES FOR UPLINK (UL) SIMULTANEOUS TRANSMISSION ACROSS MULTI-P...

DISTRIBUTED RADIOHEAD SYSTEM

UNIFIED TRANSMISSION CONFIGURATION INDICATOR (TCI) FRAMEWORK FOR MU...

RADIO FREQUENCY INTERFERENCE (RFI) SHIELDED SUBSTRATE-INTEGRATED-WA...

LOW-COST SURFACE MOUNT EMI GASKETS

COMPUTING SYSTEM CHASSIS DESIGN FOR NOISE ISOLATION AND THERMAL AIR...

Electronic computing device having self-shielding antenna

HIGH SPEED GRID ARRAY MODULE

METHODS AND DEVICES FOR DYNAMICALLY AVOIDING RADIO FREQUENCY INTERF...

EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE

METHODS AND APPARATUS TO PROVIDE ELECTRICAL SHIELDING FOR INTEGRATE...

PACKAGE-LEVEL NOISE FILTERING FOR EMI RFI MITIGATION

ELECTROMAGNETIC INTERFERENCE SHIELDS HAVING ATTENTUATION INTERFACES

PACKAGE-LEVEL NOISE FILTERING FOR EMI RFI MITIGATION

RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE

ULTRA-LOW PROFILE PACKAGE SHIELDING TECHNIQUE USING MAGNETIC AND CO...

STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE

EMBEDDED BRIDGE SUBSTRATE HAVING AN INTEGRAL DEVICE

ELECTRONIC DEVICE PACKAGES WITH ATTENUATED ELECTROMAGNETIC INTERFER...

GROUND LAYER DESIGN IN A PRINTED CIRCUIT BOARD (PCB)

SODIMM CONNECTOR SHIELD TO REDUCE RADIO FREQUENCY INTERFERENCE (RFI)