Dong Kwon Kim

Person

East Greenbush, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bottom package with metal post interconnections
- Patent number 10,971,476
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density fan out package structure
- Patent number 10,157,823
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package on package structure and method of forming th...
- Patent number 10,049,977
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate block for PoP package
- Patent number 9,881,859
- Issue date Jan 30, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile reinforced package-on-package semiconductor device
- Patent number 9,875,997
- Issue date Jan 23, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package configurations and methods of making the same
- Patent number 9,799,628
- Issue date Oct 24, 2017
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer crack stop seal ring structure in wafer level package
- Patent number 9,679,855
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate comprising capacitor, redistribution layer and di...
- Patent number 9,659,850
- Issue date May 23, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Freestanding spacer having sub-lithographic lateral dimension and m...
- Patent number 9,653,571
- Issue date May 16, 2017
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge structure in a substrate
- Patent number 9,642,259
- Issue date May 2, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising flexible connector between integrated...
- Patent number 9,633,950
- Issue date Apr 25, 2017
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-terminal capacitor
- Patent number 9,628,052
- Issue date Apr 18, 2017
- QUALCOMM Incorporated
- Hong Bok We
- G05 - CONTROLLING REGULATING
Information Patent Grant
Substrate with conductive vias
- Patent number 9,596,768
- Issue date Mar 14, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising silicon bridge in an encapsula...
- Patent number 9,595,496
- Issue date Mar 14, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high density die to die connection and m...
- Patent number 9,595,494
- Issue date Mar 14, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene re-distribution layer (RDL) in fan out split die application
- Patent number 9,583,462
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package substrate capacitor
- Patent number 9,502,490
- Issue date Nov 22, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded sheet capacitor
- Patent number 9,502,491
- Issue date Nov 22, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising a heat-dissipation layer providing an...
- Patent number 9,490,226
- Issue date Nov 8, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising via with side barrier layer traversing...
- Patent number 9,466,554
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package substrate capacitor with configurable/controllable...
- Patent number 9,449,762
- Issue date Sep 20, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavity bridge connection for die split architecture
- Patent number 9,443,824
- Issue date Sep 13, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising high density interconnects in inorgani...
- Patent number 9,418,877
- Issue date Aug 16, 2016
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) structure including multiple dies
- Patent number 9,401,350
- Issue date Jul 26, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising coaxial interconnect
- Patent number 9,385,077
- Issue date Jul 5, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device package comprising bridge in litho-etchable layer
- Patent number 9,368,450
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package interconnections and method of making the same
- Patent number 9,355,963
- Issue date May 31, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable magnetic probe for efficient near field scanning
- Patent number 9,335,384
- Issue date May 10, 2016
- QUALCOMM Incorporated
- Kyu-Pyung Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Bandpass filter implementation on a single layer using spiral capac...
- Patent number 9,294,064
- Issue date Mar 22, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Small form factor magnetic shield for magnetorestrictive random acc...
- Patent number 9,276,199
- Issue date Mar 1, 2016
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGES WITH IMPROVED TOPOLOGY
- Publication number 20170243845
- Publication date Aug 24, 2017
- QUALCOMM Incorporated
- Jae Sik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE
- Publication number 20160379959
- Publication date Dec 29, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FREESTANDING SPACER HAVING SUB-LITHOGRAPHIC LATERAL DIMENSION AND M...
- Publication number 20160365425
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND M...
- Publication number 20160329284
- Publication date Nov 10, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE CONFIGURATIONS AND METHODS OF MAKING THE SAME
- Publication number 20160293574
- Publication date Oct 6, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE
- Publication number 20160293572
- Publication date Oct 6, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE RE-DISTRIBUTION LAYER (RDL) IN FAN OUT SPLIT DIE APPLICATION
- Publication number 20160218082
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Jae Sik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
- Publication number 20160172344
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING CAPACITOR, REDISTRIBUTION LAYER AND DI...
- Publication number 20160163628
- Publication date Jun 9, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEA...
- Publication number 20160141234
- Publication date May 19, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN AN ENCAPSULA...
- Publication number 20160133571
- Publication date May 12, 2016
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY FAN OUT PACKAGE STRUCTURE
- Publication number 20160126173
- Publication date May 5, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME
- Publication number 20160093571
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING P...
- Publication number 20160091532
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED DEVICE COMPRISING A HEAT-DISSIPATION LAYER PROVIDING AN...
- Publication number 20160049378
- Publication date Feb 18, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING TH...
- Publication number 20160035664
- Publication date Feb 4, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING COAXIAL INTERCONNECT
- Publication number 20160013125
- Publication date Jan 14, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE SUBSTRATE CAPACITOR
- Publication number 20150340425
- Publication date Nov 26, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE...
- Publication number 20150325375
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BLOCK FOR PoP PACKAGE
- Publication number 20150325509
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...
- Publication number 20150318262
- Publication date Nov 5, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SHEET CAPACITOR
- Publication number 20150311275
- Publication date Oct 29, 2015
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC INTERPOSER CAPACITOR
- Publication number 20150294791
- Publication date Oct 15, 2015
- QUALCOMM Incorporated
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN BETWEEN PATTERN FOR LOW PROFILE SUBSTRATE
- Publication number 20150294933
- Publication date Oct 15, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS AND REDISTR...
- Publication number 20150255416
- Publication date Sep 10, 2015
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH CONDUCTIVE VIAS
- Publication number 20150257282
- Publication date Sep 10, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED MULTI-TERMINAL CAPACITOR
- Publication number 20150236681
- Publication date Aug 20, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS
- Publication number 20150235991
- Publication date Aug 20, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING VIA WITH SIDE BARRIER LAYER TRAVERSING...
- Publication number 20150228556
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A SUBSTRATE WITH ALIGNING TRENCH AND/O...
- Publication number 20150214127
- Publication date Jul 30, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Dong Kwon Kim

Person

Patents Grantslast 30 patents

Bottom package with metal post interconnections

High density fan out package structure

Semiconductor package on package structure and method of forming th...

Substrate block for PoP package

Low profile reinforced package-on-package semiconductor device

Stacked package configurations and methods of making the same

Polymer crack stop seal ring structure in wafer level package

Package substrate comprising capacitor, redistribution layer and di...

Freestanding spacer having sub-lithographic lateral dimension and m...

Embedded bridge structure in a substrate

Integrated device comprising flexible connector between integrated...

Embedded multi-terminal capacitor

Substrate with conductive vias

Integrated device package comprising silicon bridge in an encapsula...

Semiconductor package with high density die to die connection and m...

Damascene re-distribution layer (RDL) in fan out split die application

Embedded package substrate capacitor

Embedded sheet capacitor

Integrated device comprising a heat-dissipation layer providing an...

Integrated device comprising via with side barrier layer traversing...

Embedded package substrate capacitor with configurable/controllable...

Cavity bridge connection for die split architecture

Integrated device comprising high density interconnects in inorgani...

Package-on-package (POP) structure including multiple dies

Integrated device comprising coaxial interconnect

Integrated device package comprising bridge in litho-etchable layer

Semiconductor package interconnections and method of making the same

Adjustable magnetic probe for efficient near field scanning

Bandpass filter implementation on a single layer using spiral capac...

Small form factor magnetic shield for magnetorestrictive random acc...

Patents Applicationslast 30 patents

FAN-OUT WAFER-LEVEL PACKAGES WITH IMPROVED TOPOLOGY

CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE

FREESTANDING SPACER HAVING SUB-LITHOGRAPHIC LATERAL DIMENSION AND M...

SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND M...

STACKED PACKAGE CONFIGURATIONS AND METHODS OF MAKING THE SAME

CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE

DAMASCENE RE-DISTRIBUTION LAYER (RDL) IN FAN OUT SPLIT DIE APPLICATION

LOW PROFILE REINFORCED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE COMPRISING CAPACITOR, REDISTRIBUTION LAYER AND DI...

INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEA...

INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN AN ENCAPSULA...

HIGH DENSITY FAN OUT PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME

FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING P...

INTEGRATED DEVICE COMPRISING A HEAT-DISSIPATION LAYER PROVIDING AN...

SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING TH...

INTEGRATED DEVICE COMPRISING COAXIAL INTERCONNECT

EMBEDDED PACKAGE SUBSTRATE CAPACITOR

EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE...

SUBSTRATE BLOCK FOR PoP PACKAGE

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...

EMBEDDED SHEET CAPACITOR

CERAMIC INTERPOSER CAPACITOR

PATTERN BETWEEN PATTERN FOR LOW PROFILE SUBSTRATE

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS AND REDISTR...

SUBSTRATE WITH CONDUCTIVE VIAS

EMBEDDED MULTI-TERMINAL CAPACITOR

BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS

INTEGRATED DEVICE COMPRISING VIA WITH SIDE BARRIER LAYER TRAVERSING...

INTEGRATED DEVICE COMPRISING A SUBSTRATE WITH ALIGNING TRENCH AND/O...