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Suwon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packages having first and second redistribution patterns
Patent number
11,996,358
Issue date
May 28, 2024
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including fine redistribution patterns
Patent number
11,923,309
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
11,854,893
Issue date
Dec 26, 2023
Samsung Electronics Co., Ltd.
Junyun Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure and semiconductor package including the same
Patent number
11,798,872
Issue date
Oct 24, 2023
Samsung Electronics Co., Ltd.
Junyun Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor package including the same
Patent number
11,664,312
Issue date
May 30, 2023
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,652,066
Issue date
May 16, 2023
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,139,251
Issue date
Oct 5, 2021
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MAN...
Publication number
20240178202
Publication date
May 30, 2024
Samsung Electronics Co., Ltd.
Byeongchan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP...
Publication number
20240162104
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240145366
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128239
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Solji SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
Publication number
20240105680
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Junyoung Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240006288
Publication date
Jan 4, 2024
Junyun Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230420397
Publication date
Dec 28, 2023
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230282582
Publication date
Sep 7, 2023
Samsung Electronics Co., Ltd.
Ju-IL CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230112006
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Dongjoon OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRY ETCHING APPARATUS AND WAFER ETCHING SYSTEM USING THE SAME
Publication number
20230104421
Publication date
Apr 6, 2023
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20230096678
Publication date
Mar 30, 2023
Samsung Electronics Co., Ltd.
Junyun KWEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230089399
Publication date
Mar 23, 2023
Samsung Electronics Co., Ltd.
Solji SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
Publication number
20230073690
Publication date
Mar 9, 2023
Samsung Electronics Co., Ltd.
Hyunsu HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20220068779
Publication date
Mar 3, 2022
Samsung Electronics Co., Ltd.
Junyun KWEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20220059442
Publication date
Feb 24, 2022
Samsung Electronics Co., Ltd.
Dongjoon OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20220037248
Publication date
Feb 3, 2022
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20220037255
Publication date
Feb 3, 2022
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20210398913
Publication date
Dec 23, 2021
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20210384137
Publication date
Dec 9, 2021
Samsung Electronics Co., Ltd.
Ju-IL CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20200152582
Publication date
May 14, 2020
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS