Dongkai Shangguan

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic encapsulation through stencil printing
- Patent number 12,156,356
- Issue date Nov 26, 2024
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,723,151
- Issue date Aug 8, 2023
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of thermal interface material in multi-chip package
- Patent number 11,682,603
- Issue date Jun 20, 2023
- Flex Ltd.
- Cheng Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Testing system for flexible sample in electronics having a retracta...
- Patent number 11,493,414
- Issue date Nov 8, 2022
- Flex Ltd.
- Weifeng Liu
- G01 - MEASURING TESTING
Information Patent Grant
Stress relief encapsulation for flexible hybrid electronics
- Patent number 11,470,717
- Issue date Oct 11, 2022
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,304,302
- Issue date Apr 12, 2022
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods, devices, and systems for electronic device molding and enc...
- Patent number 11,289,393
- Issue date Mar 29, 2022
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Embedded copper structure for microelectronics package
- Patent number 11,270,974
- Issue date Mar 8, 2022
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics encapsulation through hotmelt lamination
- Patent number 11,064,613
- Issue date Jul 13, 2021
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stress relief encapsulation for flexible hybrid electronics
- Patent number 10,999,926
- Issue date May 4, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with double side mounted board
- Patent number 10,896,877
- Issue date Jan 19, 2021
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection of multilayer printed conductive ink through filled micr...
- Patent number 10,653,010
- Issue date May 12, 2020
- Flex Ltd.
- Weifeng Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer level camera module with molded housing and method of manufac...
- Patent number 9,419,032
- Issue date Aug 16, 2016
- Nanchang O-Film Optoelectronics Technology Ltd
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated lens and chip assembly for a digital camera
- Patent number 8,477,239
- Issue date Jul 2, 2013
- DigitalOptics Corporation
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module with premolded lens housing and method of manufacture
- Patent number 8,092,102
- Issue date Jan 10, 2012
- Flextronics AP LLC
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated lens and chip assembly for a digital camera
- Patent number 7,872,686
- Issue date Jan 18, 2011
- Flextronics International USA, Inc.
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer based camera module and method of manufacture
- Patent number 7,796,187
- Issue date Sep 14, 2010
- Flextronics AP LLC
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
External adjustment mechanism for a camera lens and electronic imager
- Patent number 7,684,689
- Issue date Mar 23, 2010
- Flextronics International USA, Inc.
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Conductor systems for thick film electronic circuits
- Patent number 6,476,332
- Issue date Nov 5, 2002
- Visteon Global Technologies, Inc.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20240040703
- Publication date Feb 1, 2024
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20220330435
- Publication date Oct 13, 2022
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
- Publication number 20220238482
- Publication date Jul 28, 2022
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR STACKED DIE PACKAGES
- Publication number 20220045034
- Publication date Feb 10, 2022
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS BENDING FIXTURE DESIGN
- Publication number 20220018746
- Publication date Jan 20, 2022
- Flex Ltd.
- Weifeng Liu
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING
- Publication number 20210321524
- Publication date Oct 14, 2021
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Control of Thermal Interface Material in Multi-Chip Package
- Publication number 20210305124
- Publication date Sep 30, 2021
- Flex Ltd.
- Cheng YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...
- Publication number 20210193543
- Publication date Jun 24, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS
- Publication number 20210176857
- Publication date Jun 10, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
- Publication number 20210125958
- Publication date Apr 29, 2021
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20210100106
- Publication date Apr 1, 2021
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ELECTRONIC COMPONENTS TO PRINTED CONDUCTIVE INK
- Publication number 20210076496
- Publication date Mar 11, 2021
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS
- Publication number 20200404780
- Publication date Dec 24, 2020
- Flex Ltd.
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION
- Publication number 20200344891
- Publication date Oct 29, 2020
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MOUNTING PROTECTIVE COVERS OVER IMAGE CAPTURE DEVICES AN...
- Publication number 20140047711
- Publication date Feb 20, 2014
- Flextronics AP. LLC
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera Module with Premolded Lens Housing and Method of Manufacture
- Publication number 20110299848
- Publication date Dec 8, 2011
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated lens and chip assembly for a digital camera
- Publication number 20110115974
- Publication date May 19, 2011
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level camera module with molded housing and method of manufac...
- Publication number 20110037886
- Publication date Feb 17, 2011
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Folded package camera module and method of manufacture
- Publication number 20080170141
- Publication date Jul 17, 2008
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module with premolded lens housing and method of manufacture
- Publication number 20070278394
- Publication date Dec 6, 2007
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for mounting protective covers over image capture devices an...
- Publication number 20070236591
- Publication date Oct 11, 2007
- Samuel Waising Tam
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
External adjustment mechanism for a camera lens and electronic imager
- Publication number 20070058964
- Publication date Mar 15, 2007
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer based camera module and method of manufacture
- Publication number 20060132644
- Publication date Jun 22, 2006
- Dongkai Shangguan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated lens and chip assembly for a digital camera
- Publication number 20050185088
- Publication date Aug 25, 2005
- Vidyadhar Sitaram Kale
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Dongkai Shangguan

Person

Patents Grantslast 30 patents

Devices, systems, and methods for stacked die packages

Electronic encapsulation through stencil printing

Methods of creating exposed cavities in molded electronic devices

Control of thermal interface material in multi-chip package

Testing system for flexible sample in electronics having a retracta...

Stress relief encapsulation for flexible hybrid electronics

Methods of creating exposed cavities in molded electronic devices

Methods, devices, and systems for electronic device molding and enc...

Embedded copper structure for microelectronics package

Electronics encapsulation through hotmelt lamination

Stress relief encapsulation for flexible hybrid electronics

System in package with double side mounted board

Connection of multilayer printed conductive ink through filled micr...

Wafer level camera module with molded housing and method of manufac...

Integrated lens and chip assembly for a digital camera

Camera module with premolded lens housing and method of manufacture

Integrated lens and chip assembly for a digital camera

Wafer based camera module and method of manufacture

External adjustment mechanism for a camera lens and electronic imager

Conductor systems for thick film electronic circuits

Patents Applicationslast 30 patents

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE

DEVICES, SYSTEMS, AND METHODS FOR STACKED DIE PACKAGES

ELECTRONICS BENDING FIXTURE DESIGN

ELECTRONIC ENCAPSULATION THROUGH STENCIL PRINTING

Control of Thermal Interface Material in Multi-Chip Package

METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...

STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS

EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

SOLDER ELECTRONIC COMPONENTS TO PRINTED CONDUCTIVE INK

STRESS RELIEF ENCAPSULATION FOR FLEXIBLE HYBRID ELECTRONICS

ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION

METHOD FOR MOUNTING PROTECTIVE COVERS OVER IMAGE CAPTURE DEVICES AN...

Camera Module with Premolded Lens Housing and Method of Manufacture

Integrated lens and chip assembly for a digital camera

Wafer level camera module with molded housing and method of manufac...

Folded package camera module and method of manufacture

Camera module with premolded lens housing and method of manufacture

Method for mounting protective covers over image capture devices an...

External adjustment mechanism for a camera lens and electronic imager

Wafer based camera module and method of manufacture

Integrated lens and chip assembly for a digital camera