Donna S. Zupanski-Nielsen

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 8,026,613
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,923,849
- Issue date Apr 12, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating last level copper-to-C4 connection with inte...
- Patent number 7,863,183
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,410,833
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for producing multiple size interconnections
- Patent number 7,312,529
- Issue date Dec 25, 2007
- International Business Machines Corporation
- Lawrence Clevenger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inhibition of tin oxide formation in lead free interconnect formation
- Patent number 6,900,142
- Issue date May 31, 2005
- International Business Machines Corporation
- Emanual I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20120012642
- Publication date Jan 19, 2012
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080206979
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080203585
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080202792
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED
- Publication number 20080038913
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STACK STRUCTURES
- Publication number 20080029898
- Publication date Feb 7, 2008
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS
- Publication number 20070290345
- Publication date Dec 20, 2007
- Lawrence A. Clevenger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ILD LAYER WITH INTERMEDIATE DIELECTRIC CONSTANT MATERIAL IMMEDIATEL...
- Publication number 20070187828
- Publication date Aug 16, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING LAST LEVEL COPPER-TO-C4 CONNECTION WITH INTE...
- Publication number 20070166992
- Publication date Jul 19, 2007
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTORS AND METHODS OF MAKING
- Publication number 20070080455
- Publication date Apr 12, 2007
- International Business Machines Corporation
- Donna S. Zupanski-Nielsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS
- Publication number 20070007665
- Publication date Jan 11, 2007
- Interantional Business Machines Corporation
- Lawrence Clevenger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interconnections for flip-chip using lead-free solders and having r...
- Publication number 20050224966
- Publication date Oct 13, 2005
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION
- Publication number 20050026450
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Emanuel I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS

Donna S. Zupanski-Nielsen

Person

Patents Grantslast 30 patents

Interconnections for flip-chip using lead-free solders and having r...

Interconnections for flip-chip using lead-free solders and having r...

Method for fabricating last level copper-to-C4 connection with inte...

Interconnections for flip-chip using lead-free solders and having r...

Structure and method for producing multiple size interconnections

Inhibition of tin oxide formation in lead free interconnect formation

Patents Applicationslast 30 patents

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

VIA STACK STRUCTURES

STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS

ILD LAYER WITH INTERMEDIATE DIELECTRIC CONSTANT MATERIAL IMMEDIATEL...

METHOD FOR FABRICATING LAST LEVEL COPPER-TO-C4 CONNECTION WITH INTE...

SEMICONDUCTORS AND METHODS OF MAKING

STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS

Interconnections for flip-chip using lead-free solders and having r...

INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION