Doron Teomim

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Modiin, IL

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Patents Grantslast 30 patents

Information Patent Grant
Methods for producing packaged integrated circuit devices and packa...
- Patent number 7,033,664
- Issue date Apr 25, 2006
- Tessera Technologies Hungary Kft
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CONDUCTING MATERIALS AND METHODS FOR THE MANUFACTURE THEREOF
- Publication number 20150294756
- Publication date Oct 15, 2015
- Enhanced Surface Dynamics, Inc.
- Amir Ben Shalom
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakenin...
- Publication number 20080029885
- Publication date Feb 7, 2008
- SANDISK IL LTD.
- Avraham Meir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROVIDING INVERTED PYRAMID MULTI-DIE PACKAGE REDUCING WIR...
- Publication number 20080032451
- Publication date Feb 7, 2008
- SANDISK IL LTD.
- Avraham Meir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for producing packaged integrated circuit devices and packa...
- Publication number 20040076797
- Publication date Apr 22, 2004
- Shellcase Ltd.
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS