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Chacheongsao, TH
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
6,830,955
Issue date
Dec 14, 2004
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having semiconductor chip within central aper...
Patent number
6,762,078
Issue date
Jul 13, 2004
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board semiconductor package
Patent number
6,512,288
Issue date
Jan 28, 2003
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
6,501,184
Issue date
Dec 31, 2002
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating the same
Patent number
6,395,578
Issue date
May 28, 2002
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor package and method for manufacturing the same
Publication number
20030001285
Publication date
Jan 2, 2003
Amkor Technology, Inc.
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Having Semiconductor Chip Within Central Aper...
Publication number
20010005601
Publication date
Jun 28, 2001
WonSun Shin
H01 - BASIC ELECTRIC ELEMENTS