Douglas A. Buchberger, JR.

Person

Livermore, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitively coupled plasma reactor having very agile wafer tempera...
- Patent number 8,337,660
- Issue date Dec 25, 2012
- B/E Aerospace, Inc.
- Douglas A. Buchberger, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece in a plasma reactor using feed for...
- Patent number 8,329,586
- Issue date Dec 11, 2012
- Applied Materials, Inc.
- Douglas A. Buchberger, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic chuck with reduced arcing
- Patent number 8,270,141
- Issue date Sep 18, 2012
- Applied Materials, Inc.
- Michael D. Willwerth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma reactor with wafer backside thermal loop, two-phase internal...
- Patent number 8,221,580
- Issue date Jul 17, 2012
- Applied Materials, Inc.
- Douglas A. Buchberger, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitively coupled plasma reactor having very agile wafer tempera...
- Patent number 8,157,951
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Douglas A. Buchberger, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor with feed forward thermal control system using a the...
- Patent number 8,092,639
- Issue date Jan 10, 2012
- Advanced Thermal Sciences Corporation
- Douglas A. Buchberger, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitively coupled plasma reactor having a cooled/heated wafer su...
- Patent number 8,092,638
- Issue date Jan 10, 2012
- Applied Materials Inc.
- Paul Lukas Brillhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process uniformity across a wafer by controlling a variable...
- Patent number 8,080,479
- Issue date Dec 20, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma process uniformity across a wafer by controlling RF phase be...
- Patent number 8,076,247
- Issue date Dec 13, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cooling a wafer support at a uniform temperature in a cap...
- Patent number 8,034,180
- Issue date Oct 11, 2011
- Applied Materials, Inc.
- Paul Lukas Brillhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for agile workpiece temperature control in a plasma reactor...
- Patent number 8,021,521
- Issue date Sep 20, 2011
- Applied Materials, Inc.
- Douglas A. Buchberger, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma reactor with a multiple zone thermal control feed forward co...
- Patent number 8,012,304
- Issue date Sep 6, 2011
- Applied Materials, Inc.
- Paul Lukas Brillhart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of operating a capacitively coupled plasma reactor with dual...
- Patent number 7,988,872
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Paul Lukas Brillhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to confine plasma and reduce flow resistance i...
- Patent number 7,972,467
- Issue date Jul 5, 2011
- Applied Materials Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece in a plasma reactor with variable...
- Patent number 7,968,469
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process uniformity across a wafer by apportioning ground ret...
- Patent number 7,884,025
- Issue date Feb 8, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Improving plasma process uniformity across a wafer by apportioning...
- Patent number 7,879,731
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to confine plasma and reduce flow resistance i...
- Patent number 7,754,997
- Issue date Jul 13, 2010
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly
- Patent number 7,649,729
- Issue date Jan 19, 2010
- Applied Materials, Inc.
- Douglas A. Buchberger, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to confine plasma and reduce flow resistance i...
- Patent number 7,585,384
- Issue date Sep 8, 2009
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gasless high voltage high contact force wafer contact-cooling elect...
- Patent number 7,479,456
- Issue date Jan 20, 2009
- Applied Materials, Inc.
- Douglas A. Buchberger, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma dielectric etch process including in-situ backside polymer r...
- Patent number 7,432,209
- Issue date Oct 7, 2008
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor overhead source power electrode with low arcing tend...
- Patent number 7,196,283
- Issue date Mar 27, 2007
- Applied Materials, Inc.
- Douglas A. Buchberger, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MERIE plasma reactor with overhead RF electrode tuned to the plasma...
- Patent number 7,186,943
- Issue date Mar 6, 2007
- Applied Materials, Inc.
- Daniel J. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor with overhead RF source power electrode having a res...
- Patent number 7,141,757
- Issue date Nov 28, 2006
- Applied Materials, Inc.
- Daniel Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MERIE plasma reactor with overhead RF electrode tuned to the plasma...
- Patent number 7,132,618
- Issue date Nov 7, 2006
- Applied Materials, Inc.
- Daniel J. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor with overhead RF electrode tuned to the plasma with...
- Patent number 7,030,335
- Issue date Apr 18, 2006
- Applied Materials, Inc.
- Daniel J. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitively coupled plasma reactor with uniform radial distributio...
- Patent number 6,900,596
- Issue date May 31, 2005
- Applied Materials, Inc.
- Jang Gyoo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Merie plasma reactor with overhead RF electrode tuned to the plasma...
- Patent number 6,894,245
- Issue date May 17, 2005
- Applied Materials, Inc.
- Daniel J. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA IMMERSION CHAMBER
- Publication number 20120199071
- Publication date Aug 9, 2012
- Applied Materials, Inc.
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT WITH SYMMETRICAL FEED STRUCTURE
- Publication number 20120097332
- Publication date Apr 26, 2012
- Applied Materials, Inc.
- XING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CONTROLLING SUBSTRATE TEMPERATURE IN A PR...
- Publication number 20120091108
- Publication date Apr 19, 2012
- Applied Materials, Inc.
- XING LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEM...
- Publication number 20120091104
- Publication date Apr 19, 2012
- Applied Materials, Inc.
- Hamid Tavassoli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY FOR DELIVERING RF POWER AND DC VOLTAGE TO A PLASMA PROCESS...
- Publication number 20110297650
- Publication date Dec 8, 2011
- Applied Materials, Inc.
- Hamid Tavassoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS
- Publication number 20110186545
- Publication date Aug 4, 2011
- Applied Materials, Inc.
- Chetan MAHADESWARASWAMY
- G05 - CONTROLLING REGULATING
Information Patent Application
APPARATUS FOR CONTROLLING TEMPERATURE UNIFORMITY OF A SHOWERHEAD
- Publication number 20110180233
- Publication date Jul 28, 2011
- Applied Materials, Inc.
- KALLOL BERA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
APPARATUS FOR CONTROLLING TEMPERATURE UNIFORMITY OF A SUBSTRATE
- Publication number 20110180243
- Publication date Jul 28, 2011
- Applied Materials, Inc.
- KALLOL BERA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTROSTATIC CHUCK WITH REDUCED ARCING
- Publication number 20110157760
- Publication date Jun 30, 2011
- Applied Materials, Inc.
- MICHAEL D. WILLWERTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR USING MULTIPLE...
- Publication number 20110068085
- Publication date Mar 24, 2011
- Paul Lukas Brillhart
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR USING FEED FOR...
- Publication number 20110065279
- Publication date Mar 17, 2011
- Douglas A. Buchberger, JR.
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
PLASMA REACTOR WITH FEED FORWARD THERMAL CONTROL SYSTEM USING A THE...
- Publication number 20100319851
- Publication date Dec 23, 2010
- Douglas A. Buchberger, JR.
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
CAPACITIVLEY COUPLED PLASMA REACTOR HAVING A COOLED/HEATED WAFER SU...
- Publication number 20100319852
- Publication date Dec 23, 2010
- Paul Lukas Brillhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR WITH A MULTIPLE ZONE THERMAL CONTROL FEED FORWARD CO...
- Publication number 20100314046
- Publication date Dec 16, 2010
- Paul Lukas Brillhart
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
CAPACITIVELY COUPLED PLASMA REACTOR HAVING VERY AGILE WAFER TEMPERA...
- Publication number 20100303680
- Publication date Dec 2, 2010
- Douglas A. Buchberger, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COOLING A WAFER SUPPORT AT A UNIFORM TEMPERATURE IN A CAP...
- Publication number 20100300621
- Publication date Dec 2, 2010
- Paul Lukas Brillhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE SUPPORT FOR A PLASMA REACTOR WITH CONTROLLED APPORTIONMEN...
- Publication number 20100018648
- Publication date Jan 28, 2010
- Applied Marterials, Inc.
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHODE WITH INNER AND OUTER ELECTRODES AT DIFFERENT HEIGHTS
- Publication number 20090314433
- Publication date Dec 24, 2009
- Daniel J. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR ELECTROSTATIC CHUCK HAVING A COAXIAL RF FEED AND MUL...
- Publication number 20090274590
- Publication date Nov 5, 2009
- Applied Materials, Inc.
- MICHAEL D. WILLWERTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF A SUBSTRATE ETCHING SYSTEM AND PROCESS
- Publication number 20090272717
- Publication date Nov 5, 2009
- Applied Materials, Inc.
- Sharma V. Pamarthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of controlling plasma distribution uniformity by superpositi...
- Publication number 20090250335
- Publication date Oct 8, 2009
- Daniel J. Hoffman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of controlling plasma distribution uniformity by time-weight...
- Publication number 20090250432
- Publication date Oct 8, 2009
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING TEMPERATURE OF A SUBSTRATE
- Publication number 20090159566
- Publication date Jun 25, 2009
- Applied Materials, Inc.
- Paul L. Brillhart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC CHUCK ASSEMBLY
- Publication number 20090097184
- Publication date Apr 16, 2009
- APPLIED MATERIALS, INC.
- DOUGLAS A. BUCHBERGER, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD TO CONFINE PLASMA AND REDUCE FLOW RESISTANCE I...
- Publication number 20080314522
- Publication date Dec 25, 2008
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS

Douglas A. Buchberger, JR.

Person

Patents Grantslast 30 patents

Capacitively coupled plasma reactor having very agile wafer tempera...

Method of processing a workpiece in a plasma reactor using feed for...

Electrostatic chuck with reduced arcing

Plasma reactor with wafer backside thermal loop, two-phase internal...

Capacitively coupled plasma reactor having very agile wafer tempera...

Plasma reactor with feed forward thermal control system using a the...

Capacitively coupled plasma reactor having a cooled/heated wafer su...

Plasma process uniformity across a wafer by controlling a variable...

Plasma process uniformity across a wafer by controlling RF phase be...

Method of cooling a wafer support at a uniform temperature in a cap...

Method for agile workpiece temperature control in a plasma reactor...

Plasma reactor with a multiple zone thermal control feed forward co...

Method of operating a capacitively coupled plasma reactor with dual...

Apparatus and method to confine plasma and reduce flow resistance i...

Method of processing a workpiece in a plasma reactor with variable...

Plasma process uniformity across a wafer by apportioning ground ret...

Improving plasma process uniformity across a wafer by apportioning...

Apparatus and method to confine plasma and reduce flow resistance i...

Electrostatic chuck assembly

Apparatus and method to confine plasma and reduce flow resistance i...

Gasless high voltage high contact force wafer contact-cooling elect...

Plasma dielectric etch process including in-situ backside polymer r...

Plasma reactor overhead source power electrode with low arcing tend...

MERIE plasma reactor with overhead RF electrode tuned to the plasma...

Plasma reactor with overhead RF source power electrode having a res...

MERIE plasma reactor with overhead RF electrode tuned to the plasma...

Plasma reactor with overhead RF electrode tuned to the plasma with...

Capacitively coupled plasma reactor with uniform radial distributio...

Merie plasma reactor with overhead RF electrode tuned to the plasma...

Patents Applicationslast 30 patents

PLASMA IMMERSION CHAMBER

SUBSTRATE SUPPORT WITH SYMMETRICAL FEED STRUCTURE

METHODS AND APPARATUS FOR CONTROLLING SUBSTRATE TEMPERATURE IN A PR...

MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEM...

ASSEMBLY FOR DELIVERING RF POWER AND DC VOLTAGE TO A PLASMA PROCESS...

FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS

APPARATUS FOR CONTROLLING TEMPERATURE UNIFORMITY OF A SHOWERHEAD

APPARATUS FOR CONTROLLING TEMPERATURE UNIFORMITY OF A SUBSTRATE

ELECTROSTATIC CHUCK WITH REDUCED ARCING

METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR USING MULTIPLE...

METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR USING FEED FOR...

PLASMA REACTOR WITH FEED FORWARD THERMAL CONTROL SYSTEM USING A THE...

CAPACITIVLEY COUPLED PLASMA REACTOR HAVING A COOLED/HEATED WAFER SU...

PLASMA REACTOR WITH A MULTIPLE ZONE THERMAL CONTROL FEED FORWARD CO...

CAPACITIVELY COUPLED PLASMA REACTOR HAVING VERY AGILE WAFER TEMPERA...

METHOD OF COOLING A WAFER SUPPORT AT A UNIFORM TEMPERATURE IN A CAP...

WORKPIECE SUPPORT FOR A PLASMA REACTOR WITH CONTROLLED APPORTIONMEN...

CATHODE WITH INNER AND OUTER ELECTRODES AT DIFFERENT HEIGHTS

PLASMA REACTOR ELECTROSTATIC CHUCK HAVING A COAXIAL RF FEED AND MUL...

METHOD AND APPARATUS OF A SUBSTRATE ETCHING SYSTEM AND PROCESS

Method of controlling plasma distribution uniformity by superpositi...

Method of controlling plasma distribution uniformity by time-weight...

METHOD AND APPARATUS FOR CONTROLLING TEMPERATURE OF A SUBSTRATE

ELECTROSTATIC CHUCK ASSEMBLY

APPARATUS AND METHOD TO CONFINE PLASMA AND REDUCE FLOW RESISTANCE I...