Douglas C. La Tulipe Jr.

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photonics optoelectrical system
- Patent number 12,366,705
- Issue date Jul 22, 2025
- THE RESEARCH FOUNDATION FOR THE STATE UNIVERISTY OF NEWYORK
- William Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous structure on an integrated photonics platform
- Patent number 11,550,173
- Issue date Jan 10, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- G02 - OPTICS
Information Patent Grant
Photonics optoelectrical system
- Patent number 11,550,099
- Issue date Jan 10, 2023
- The Research Foundation for the State University of New York
- William Charles
- G02 - OPTICS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,435,523
- Issue date Sep 6, 2022
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics structure with integrated laser
- Patent number 11,029,466
- Issue date Jun 8, 2021
- The Research Foundation for the State University of New York
- William Charles
- G02 - OPTICS
Information Patent Grant
Photonics interposer optoelectronics
- Patent number 10,976,491
- Issue date Apr 13, 2021
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous structure on an integrated photonics platform
- Patent number 10,877,300
- Issue date Dec 29, 2020
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- G02 - OPTICS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 10,698,156
- Issue date Jun 30, 2020
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with diffusion barrier structures
- Patent number 9,620,481
- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a low-K spacer and method of forming the...
- Patent number 9,583,628
- Issue date Feb 28, 2017
- GLOBALFOUNDRIES Inc.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination of TSV and back side wiring in 3D integration
- Patent number 9,543,229
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Pooja R. Batra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination of TSV and back side wiring in 3D integration
- Patent number 9,536,809
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Pooja R. Batra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit device fabrication including w...
- Patent number 9,412,620
- Issue date Aug 9, 2016
- GLOBALFOUNDRIES Inc.
- Douglas C. La Tulipe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating ultra-deep vias and three-dimensional integra...
- Patent number 9,318,375
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted thin channel mosfet with self-aligned expanded source/drain
- Patent number 9,219,129
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Bruce B. Doris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing wafer bonding misalignment by varying thermal treatment pr...
- Patent number 9,190,303
- Issue date Nov 17, 2015
- Globalfoudries Inc.
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making a semiconductor device with shaped source and dr...
- Patent number 9,190,517
- Issue date Nov 17, 2015
- STMicroelectronics, Inc.
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler wafer removal facilitated by the addition of an amorphous c...
- Patent number 9,171,749
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with diffusion barrier structures
- Patent number 9,064,937
- Issue date Jun 23, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing wafer bonding misalignment by varying thermal treatment pr...
- Patent number 9,059,039
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a low-k spacer and method of forming the...
- Patent number 9,034,701
- Issue date May 19, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced handler wafer bonding and debonding
- Patent number 9,029,238
- Issue date May 12, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit device using a wafer scale mem...
- Patent number 8,963,278
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted thin channel mosfet with self-aligned expanded source/drain
- Patent number 8,946,007
- Issue date Feb 3, 2015
- International Business Machines Corporation
- Bruce B. Doris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creating an extremely thin semiconductor-on-insulator (ET...
- Patent number 8,940,554
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Nathaniel C. Berliner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect-transistor with self-aligned diffusion contact
- Patent number 8,928,091
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Charles W. Koburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making a semiconductor device with shaped source and dr...
- Patent number 8,900,978
- Issue date Dec 2, 2014
- STMicroelectronics, Inc.
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding misalignment reduction
- Patent number 8,900,885
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Alex R. Hubbard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed air gap for semiconductor chip
- Patent number 8,871,624
- Issue date Oct 28, 2014
- International Business Machines Corporation
- David V. Horak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONICS OPTOELECTRICAL SYSTEM
- Publication number 20230244029
- Publication date Aug 3, 2023
- The Research Foundation for the State University of New York
- William CHARLES
- G02 - OPTICS
Information Patent Application
WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER
- Publication number 20220381974
- Publication date Dec 1, 2022
- The Research Foundation for the State University of New York
- Douglas COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS STRUCTURE ON AN INTEGRATED PHOTONICS PLATFORM
- Publication number 20210072568
- Publication date Mar 11, 2021
- The Research Foundation for the State University of New York
- Douglas COOLBAUGH
- G02 - OPTICS
Information Patent Application
WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER
- Publication number 20200319403
- Publication date Oct 8, 2020
- The Research Foundation for the State University of New York
- Douglas COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS STRUCTURE WITH INTEGRATED LASER
- Publication number 20200166703
- Publication date May 28, 2020
- The Research Foundation for the State University of New York
- William CHARLES
- G02 - OPTICS
Information Patent Application
PHOTONICS OPTOELECTRICAL SYSTEM
- Publication number 20200166720
- Publication date May 28, 2020
- The Research Foundation for the State University of New York
- William CHARLES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER
- Publication number 20180314003
- Publication date Nov 1, 2018
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS INTERPOSER OPTOELECTRONICS
- Publication number 20180143374
- Publication date May 24, 2018
- The Research Foundation for the State University of New York
- Douglas COOLBAUGH
- G02 - OPTICS
Information Patent Application
COMBINATION OF TSV AND BACK SIDE WIRING IN 3D INTEGRATION
- Publication number 20150371927
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Pooja R. Batra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING WAFER BONDING MISALIGNMENT BY VARYING THERMAL TREATMENT PR...
- Publication number 20150279709
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
- Publication number 20150262976
- Publication date Sep 17, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION OF TSV AND BACK SIDE WIRING IN 3D INTEGRATION
- Publication number 20150187733
- Publication date Jul 2, 2015
- International Business Machines Corporation
- Pooja R. Batra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE FABRICATION INCLUDING W...
- Publication number 20150147869
- Publication date May 28, 2015
- International Business Machines Corporation
- Douglas C. LA TULIPE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LOW-K SPACER AND METHOD OF FORMING THE...
- Publication number 20150137240
- Publication date May 21, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER WAFER REMOVAL
- Publication number 20150132924
- Publication date May 14, 2015
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Wafer Bonding Misalignment By Varying Thermal Treatment Pr...
- Publication number 20150072444
- Publication date Mar 12, 2015
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING A SEMICONDUCTOR DEVICE WITH SHAPED SOURCE AND DR...
- Publication number 20150054032
- Publication date Feb 26, 2015
- STMicroelectronics, Inc.
- NICOLAS LOUBET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING MISALIGNMENT REDUCTION
- Publication number 20140356981
- Publication date Dec 4, 2014
- International Business Machines Corporation
- Alex R. HUBBARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
- Publication number 20140353828
- Publication date Dec 4, 2014
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING A SEMICONDUCTOR DEVICE WITH SHAPED SOURCE AND DR...
- Publication number 20140353714
- Publication date Dec 4, 2014
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRING TO TRANSISTOR AND RELATED TRANSISTOR
- Publication number 20140145264
- Publication date May 29, 2014
- International Business Machines Corporation
- David J. Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED HANDLER WAFER BONDING AND DEBONDING
- Publication number 20140106473
- Publication date Apr 17, 2014
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED HANDLER WAFER BONDING AND DEBONDING
- Publication number 20140103499
- Publication date Apr 17, 2014
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT-TRANSISTOR WITH SELF-ALIGNED DIFFUSION CONTACT
- Publication number 20140091391
- Publication date Apr 3, 2014
- International Business Machines Corporation
- Charles W. Koburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE USING A WAFER SCALE MEM...
- Publication number 20140077330
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Douglas C. LA TULIPE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NON-RELAXED EMBEDDED STRESSORS WITH SOLID SOURCE EXTENSION REGIONS...
- Publication number 20130337621
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Protection of Bonded Wafers During Wafer Thinning
- Publication number 20130328174
- Publication date Dec 12, 2013
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED THIN CHANNEL MOSFET WITH SELF-ALIGNED EXPANDED SOURCE/DRAIN
- Publication number 20130302950
- Publication date Nov 14, 2013
- International Business Machines Corporation
- Bruce B. Doris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED THIN CHANNEL MOSFET WITH SELF-ALIGNED EXPANDED SOURCE/DRAIN
- Publication number 20130299897
- Publication date Nov 14, 2013
- International Business Machines Corporation
- Bruce B. Doris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LOW-K SPACER AND METHOD OF FORMING THE...
- Publication number 20130187229
- Publication date Jul 25, 2013
- International Business Machines Corporation
- KANGGUO CHENG
- H01 - BASIC ELECTRIC ELEMENTS

Douglas C. La Tulipe Jr.

Person

Patents Grantslast 30 patents

Photonics optoelectrical system

Wafer scale bonded active photonics interposer

Heterogeneous structure on an integrated photonics platform

Photonics optoelectrical system

Wafer scale bonded active photonics interposer

Photonics structure with integrated laser

Photonics interposer optoelectronics

Heterogeneous structure on an integrated photonics platform

Wafer scale bonded active photonics interposer

Substrate bonding with diffusion barrier structures

Semiconductor device with a low-K spacer and method of forming the...

Combination of TSV and back side wiring in 3D integration

Combination of TSV and back side wiring in 3D integration

Three-dimensional integrated circuit device fabrication including w...

Method of fabricating ultra-deep vias and three-dimensional integra...

Inverted thin channel mosfet with self-aligned expanded source/drain

Reducing wafer bonding misalignment by varying thermal treatment pr...

Methods for making a semiconductor device with shaped source and dr...

Handler wafer removal facilitated by the addition of an amorphous c...

Substrate bonding with diffusion barrier structures

Reducing wafer bonding misalignment by varying thermal treatment pr...

Semiconductor device with a low-k spacer and method of forming the...

Advanced handler wafer bonding and debonding

Three-dimensional integrated circuit device using a wafer scale mem...

Inverted thin channel mosfet with self-aligned expanded source/drain

Method of creating an extremely thin semiconductor-on-insulator (ET...

Field-effect-transistor with self-aligned diffusion contact

Methods for making a semiconductor device with shaped source and dr...

Wafer bonding misalignment reduction

Sealed air gap for semiconductor chip

Patents Applicationslast 30 patents

PHOTONICS OPTOELECTRICAL SYSTEM

WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER

HETEROGENEOUS STRUCTURE ON AN INTEGRATED PHOTONICS PLATFORM

WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER

PHOTONICS STRUCTURE WITH INTEGRATED LASER

PHOTONICS OPTOELECTRICAL SYSTEM

WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER

PHOTONICS INTERPOSER OPTOELECTRONICS

COMBINATION OF TSV AND BACK SIDE WIRING IN 3D INTEGRATION

REDUCING WAFER BONDING MISALIGNMENT BY VARYING THERMAL TREATMENT PR...

SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES

COMBINATION OF TSV AND BACK SIDE WIRING IN 3D INTEGRATION

THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE FABRICATION INCLUDING W...

SEMICONDUCTOR DEVICE WITH A LOW-K SPACER AND METHOD OF FORMING THE...

HANDLER WAFER REMOVAL

Reducing Wafer Bonding Misalignment By Varying Thermal Treatment Pr...

METHODS FOR MAKING A SEMICONDUCTOR DEVICE WITH SHAPED SOURCE AND DR...

WAFER BONDING MISALIGNMENT REDUCTION

SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES

METHODS FOR MAKING A SEMICONDUCTOR DEVICE WITH SHAPED SOURCE AND DR...

METHODS OF FORMING WIRING TO TRANSISTOR AND RELATED TRANSISTOR

ADVANCED HANDLER WAFER BONDING AND DEBONDING

ADVANCED HANDLER WAFER BONDING AND DEBONDING

FIELD-EFFECT-TRANSISTOR WITH SELF-ALIGNED DIFFUSION CONTACT

THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE USING A WAFER SCALE MEM...

NON-RELAXED EMBEDDED STRESSORS WITH SOLID SOURCE EXTENSION REGIONS...

Edge Protection of Bonded Wafers During Wafer Thinning

INVERTED THIN CHANNEL MOSFET WITH SELF-ALIGNED EXPANDED SOURCE/DRAIN

INVERTED THIN CHANNEL MOSFET WITH SELF-ALIGNED EXPANDED SOURCE/DRAIN

SEMICONDUCTOR DEVICE WITH A LOW-K SPACER AND METHOD OF FORMING THE...