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Douglas G. Mitchell
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Tempe, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic packages having trench vias and methods for the man...
Patent number
9,520,323
Issue date
Dec 13, 2016
FREESCALE SEMICONDUCTOR, INC.
Michael B Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level packages and methods for producing wafer level packages...
Patent number
9,502,363
Issue date
Nov 22, 2016
FREESCALE SEMICONDUCTOR, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages having layered interconnect structures and...
Patent number
9,281,293
Issue date
Mar 8, 2016
Freescale Semiconductor Inc.
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging having pre-encapsulation through via...
Patent number
9,142,502
Issue date
Sep 22, 2015
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages having frontside thermal contacts and meth...
Patent number
9,123,685
Issue date
Sep 1, 2015
Freescale Semiconductor Inc.
Weng Foong Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic packages and methods for the fabrication thereof
Patent number
9,018,045
Issue date
Apr 28, 2015
Freescale Semiconductor Inc.
Weng Foong Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having backside contact and method for...
Patent number
8,685,790
Issue date
Apr 1, 2014
FREESCALE SEMICONDUCTOR, INC.
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming through-substrate conductor filled vias, and el...
Patent number
8,283,207
Issue date
Oct 9, 2012
Freescale Semiconductors, Inc.
Chandrasekaram Ramiah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a packaged semiconductor device
Patent number
8,216,918
Issue date
Jul 10, 2012
FREESCALE SEMICONDUCTOR, INC.
Zhiwei Gong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
MEMS microphone with cavity and method therefor
Patent number
8,158,492
Issue date
Apr 17, 2012
FREESCALE SEMICONDUCTOR, INC.
Lianjun Liu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Integrated conformal shielding method and process using redistribut...
Patent number
7,981,730
Issue date
Jul 19, 2011
FREESCALE SEMICONDUCTOR, INC.
Jinbang Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for controlling warpage in redistributed chip packaging panels
Patent number
7,950,144
Issue date
May 31, 2011
FREESCALE SEMICONDUCTOR, INC.
Lakshmi N. Ramanathan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Through substrate vias for back-side interconnections on very thin...
Patent number
7,935,571
Issue date
May 3, 2011
FREESCALE SEMICONDUCTOR, INC.
Chandrasekaram Ramiah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging
Patent number
7,425,464
Issue date
Sep 16, 2008
FREESCALE SEMICONDUCTOR, INC.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip structure and method for high quality inductors and trans...
Patent number
6,878,633
Issue date
Apr 12, 2005
FREESCALE SEMICONDUCTOR, INC.
Glenn D. Raskin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a component overlying a semiconductor substrate
Patent number
6,803,323
Issue date
Oct 12, 2004
FREESCALE SEMICONDUCTOR, INC.
Lakshmi Narayan Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor component
Patent number
6,726,826
Issue date
Apr 27, 2004
Motorola, Inc.
Timothy Lee Johnson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
System and method for providing rotation to plating flow
Patent number
6,517,698
Issue date
Feb 11, 2003
Motorola, Inc.
Timothy L. Johnson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method of manufacturing electronic components
Patent number
6,436,300
Issue date
Aug 20, 2002
Motorola, Inc.
Eric J. Woolsey
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of manufacturing electronic components
Patent number
6,413,878
Issue date
Jul 2, 2002
Motorola, Inc.
Eric J. Woolsey
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Fine pitch bumping with improved device standoff and bump volume
Patent number
6,372,622
Issue date
Apr 16, 2002
Motorola, Inc.
Qing Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor component and plating tool...
Patent number
6,361,675
Issue date
Mar 26, 2002
Motorola, Inc.
Timothy Lee Johnson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Interconnect system and method of fabrication
Patent number
5,773,359
Issue date
Jun 30, 1998
Motorola, Inc.
Douglas G. Mitchell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical interconnect and method for forming the same
Patent number
5,480,835
Issue date
Jan 2, 1996
Motorola, Inc.
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization scheme providing adhesion and barrier properties
Patent number
4,927,505
Issue date
May 22, 1990
Motorola Inc.
Ravinder K. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization scheme providing adhesion and barrier properties
Patent number
4,880,708
Issue date
Nov 14, 1989
Motorola, Inc.
Ravinder K. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...
Publication number
20150270233
Publication date
Sep 24, 2015
MICHAEL B. VINCENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...
Publication number
20150115454
Publication date
Apr 30, 2015
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF
Publication number
20150014855
Publication date
Jan 15, 2015
WENG FOONG YAP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES HAVING FRONTSIDE THERMAL CONTACTS AND METH...
Publication number
20150014838
Publication date
Jan 15, 2015
WENG FOONG YAP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...
Publication number
20140167247
Publication date
Jun 19, 2014
FREESCALE SEMICONDUCTOR IN.
ALAN J. MAGNUS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGES HAVING TRENCH VIAS AND METHODS FOR THE MAN...
Publication number
20140070415
Publication date
Mar 13, 2014
FREESCALE SEMICONDUCTOR, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...
Publication number
20130207255
Publication date
Aug 15, 2013
Alan J. Magnus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING USING ENCAPSULATED CONDUCTIVE BALLS...
Publication number
20130154091
Publication date
Jun 20, 2013
Jason R. Wright
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA...
Publication number
20130049217
Publication date
Feb 28, 2013
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE
Publication number
20120021565
Publication date
Jan 26, 2012
Zhiwei Gong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR FORMING THROUGH-SUBSTRATE CONDUCTOR FILLED VIAS, AND EL...
Publication number
20110156266
Publication date
Jun 30, 2011
FREESCALE SEMICONDUCTOR, INC.
Chandrasekaram Ramiah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMS MICROPHONE WITH CAVITY AND METHOD THEREFOR
Publication number
20100276767
Publication date
Nov 4, 2010
Lianjun Liu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
THROUGH SUBSTRATE VIAS FOR BACK-SIDE INTERCONNECTIONS ON VERY THIN...
Publication number
20100127394
Publication date
May 27, 2010
FREESCALE SEMICONDUCTOR, INC.
Chandrasekaram Ramiah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Conformal Shielding Method and Process Using Redistribut...
Publication number
20100006988
Publication date
Jan 14, 2010
Jinbang Tang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR CONTROLLING WARPAGE IN REDISTRIBUTED CHIP PACKAGING PANELS
Publication number
20090271980
Publication date
Nov 5, 2009
Lakshmi N. Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device packaging
Publication number
20070210461
Publication date
Sep 13, 2007
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip-chip structure and method for high quality inductors and trans...
Publication number
20040121606
Publication date
Jun 24, 2004
MOTOROLA, INC.
Glenn D. Raskin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a component overlying a semiconductor substrate
Publication number
20030224613
Publication date
Dec 4, 2003
Lakshmi Narayan Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect system and method of fabrication
Publication number
20030006062
Publication date
Jan 9, 2003
William M. Stone
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a semiconductor component and plating tool...
Publication number
20020040853
Publication date
Apr 11, 2002
Timothy Lee Johnson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENTS
Publication number
20010008224
Publication date
Jul 19, 2001
ERIC J. WOOLSEY
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...