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Douglas L. McKay
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San Jose, CA, US
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Patents Grants
last 30 patents
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Patent Grant
High density interconnect system having rapid fabrication cycle
Patent number
7,884,634
Issue date
Feb 8, 2011
Verigy (Singapore) PTE, Ltd.
Fu Chiung Chong
G01 - MEASURING TESTING
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Patent Grant
High density interconnect system having rapid fabrication cycle
Patent number
7,872,482
Issue date
Jan 18, 2011
Verigy (Singapore) Pte. Ltd.
Fu Chiung Chong
G01 - MEASURING TESTING
Information
Patent Grant
High density interconnect system having rapid fabrication cycle
Patent number
7,382,142
Issue date
Jun 3, 2008
NanoNexus, Inc.
Fu Chiung Chong
G01 - MEASURING TESTING
Patents Applications
last 30 patents
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Patent Application
Construction Structures and Manufacturing Processes for Integrated...
Publication number
20120212248
Publication date
Aug 23, 2012
Fu Chiung Chong
G01 - MEASURING TESTING
Information
Patent Application
CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED...
Publication number
20120023730
Publication date
Feb 2, 2012
Fu Chiung Chong
G01 - MEASURING TESTING
Information
Patent Application
Construction Structures and Manufacturing Processes for Integrated...
Publication number
20100026331
Publication date
Feb 4, 2010
Fu Chiung Chong
G01 - MEASURING TESTING
Information
Patent Application
High Density Interconnect System Having Rapid Fabrication Cycle
Publication number
20090153165
Publication date
Jun 18, 2009
Fu Chiung CHONG
G01 - MEASURING TESTING
Information
Patent Application
HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE
Publication number
20080246500
Publication date
Oct 9, 2008
Fu Chiung CHONG
G01 - MEASURING TESTING
Information
Patent Application
High density interconnect system having rapid fabrication cycle
Publication number
20050275418
Publication date
Dec 15, 2005
Fu Chiung Chong
G01 - MEASURING TESTING