Drew W. Delaney

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming an interference shield on a substrate
- Patent number 10,375,832
- Issue date Aug 6, 2019
- Intel Corporation
- Digvijay A. Raorane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bumpless build-up layer package warpage reduction
- Patent number 9,627,227
- Issue date Apr 18, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
- Patent number 9,406,618
- Issue date Aug 2, 2016
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming functionalized carrier structures with coreless packages
- Patent number 9,257,380
- Issue date Feb 9, 2016
- Intel Corporation
- Ravi K. Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film based electromagnetic interference shielding with BBUL/co...
- Patent number 9,232,686
- Issue date Jan 5, 2016
- Intel Corporation
- Digvijay A. Raorane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microelectronic package and stacked microelectronic assembly and co...
- Patent number 9,159,649
- Issue date Oct 13, 2015
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming functionalized carrier structures with coreless packages
- Patent number 8,987,065
- Issue date Mar 24, 2015
- Intel Corporation
- Ravi K. Nailla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package and method of manufacturing same
- Patent number 8,896,116
- Issue date Nov 25, 2014
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package warpage reduction
- Patent number 8,848,380
- Issue date Sep 30, 2014
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
- Patent number 8,786,066
- Issue date Jul 22, 2014
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming functionalized carrier structures with coreless packages
- Patent number 8,618,652
- Issue date Dec 31, 2013
- Intel Corporation
- Ravi K Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming metal filled die back-side film for electromagnetic interfe...
- Patent number 8,507,324
- Issue date Aug 13, 2013
- Intel Corporation
- Ravi K Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming metal filled die back-side film for electromagnetic interfe...
- Patent number 8,319,318
- Issue date Nov 27, 2012
- Intel Corporation
- Ravi K Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of reducing bleed-out of underfill and adhesive materials
- Patent number 7,141,452
- Issue date Nov 28, 2006
- Intel Corporation
- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...
- Publication number 20160088738
- Publication date Mar 24, 2016
- Intel Corporation
- Digvijay A. RAORANE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND CO...
- Publication number 20150340312
- Publication date Nov 26, 2015
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...
- Publication number 20150282395
- Publication date Oct 1, 2015
- Digvijay A. RAORANE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES
- Publication number 20150179559
- Publication date Jun 25, 2015
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE WARPAGE REDUCTION
- Publication number 20140363929
- Publication date Dec 11, 2014
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
- Publication number 20140327149
- Publication date Nov 6, 2014
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
- Publication number 20140295621
- Publication date Oct 2, 2014
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES
- Publication number 20140084467
- Publication date Mar 27, 2014
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND CO...
- Publication number 20130270719
- Publication date Oct 17, 2013
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20130119544
- Publication date May 16, 2013
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFE...
- Publication number 20130052776
- Publication date Feb 28, 2013
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE WARPAGE REDUCTION
- Publication number 20130003319
- Publication date Jan 3, 2013
- PRAMOD MALATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
- Publication number 20120074581
- Publication date Mar 29, 2012
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20110316140
- Publication date Dec 29, 2011
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES
- Publication number 20110254124
- Publication date Oct 20, 2011
- Ravi K. Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFE...
- Publication number 20110241186
- Publication date Oct 6, 2011
- Ravi K. Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of reducing bleed-out of underfill and adhesive materials
- Publication number 20050118748
- Publication date Jun 2, 2005
- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of electrically coupling an electronic component to a substrate
- Publication number 20030183416
- Publication date Oct 2, 2003
- Jerry L. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Drew W. Delaney

Person

Patents Grantslast 30 patents

Method of forming an interference shield on a substrate

Bumpless build-up layer package warpage reduction

Die-stacking using through-silicon vias on bumpless build-up layer...

Forming functionalized carrier structures with coreless packages

Thin film based electromagnetic interference shielding with BBUL/co...

Microelectronic package and stacked microelectronic assembly and co...

Forming functionalized carrier structures with coreless packages

Microelectronic package and method of manufacturing same

Bumpless build-up layer package warpage reduction

Die-stacking using through-silicon vias on bumpless build-up layer...

Forming functionalized carrier structures with coreless packages

Forming metal filled die back-side film for electromagnetic interfe...

Forming metal filled die back-side film for electromagnetic interfe...

Methods of reducing bleed-out of underfill and adhesive materials

Patents Applicationslast 30 patents

THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...

MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND CO...

THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...

FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES

BUMPLESS BUILD-UP LAYER PACKAGE WARPAGE REDUCTION

DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...

DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...

FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES

MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND CO...

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFE...

BUMPLESS BUILD-UP LAYER PACKAGE WARPAGE REDUCTION

DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

FORMING FUNCTIONALIZED CARRIER STRUCTURES WITH CORELESS PACKAGES

FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFE...

Methods of reducing bleed-out of underfill and adhesive materials

Method of electrically coupling an electronic component to a substrate