Dror HURWITZ

Person

Gilboa, IL

People

Patents Grantslast 30 patents

Information Patent Grant
Advanced multilayer coreless support structures and method for thei...
- Patent number 7,682,972
- Issue date Mar 23, 2010
- Amitec-Advanced Multilayer Interconnect Technoloiges Ltd.
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless cavity substrates for chip packaging and their fabrication
- Patent number 7,669,320
- Issue date Mar 2, 2010
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit support structures and their fabrication
- Patent number 7,635,641
- Issue date Dec 22, 2009
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a chip carrier substrate
- Patent number 6,280,640
- Issue date Aug 28, 2001
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier substrate
- Patent number 6,262,376
- Issue date Jul 17, 2001
- Amitec-Advanced Multilayer Interconnect Technoligies Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic interconnect structure and method for manufacturing it
- Patent number 6,262,478
- Issue date Jul 17, 2001
- Amitec-Advanced Multilayer Interconnect Technologies Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic structure
- Patent number 5,946,600
- Issue date Aug 31, 1999
- P.C.B. Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CORELESS CAVITY SUBSTRATES FOR CHIP PACKAGING AND THEIR FABRICATION
- Publication number 20070289127
- Publication date Dec 20, 2007
- Amitec- Advanced Multilayer Interconnect Technologies LTD
- Dror HURWITZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Multilayered Coreless Support Structures and their Fabrica...
- Publication number 20070281471
- Publication date Dec 6, 2007
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Novel integrated circuit support structures and their fabrication
- Publication number 20070082501
- Publication date Apr 12, 2007
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dror HURWITZ

Person

Patents Grantslast 30 patents

Advanced multilayer coreless support structures and method for thei...

Coreless cavity substrates for chip packaging and their fabrication

Integrated circuit support structures and their fabrication

Process for manufacturing a chip carrier substrate

Chip carrier substrate

Electronic interconnect structure and method for manufacturing it

Method for manufacturing an electronic structure

Patents Applicationslast 30 patents

CORELESS CAVITY SUBSTRATES FOR CHIP PACKAGING AND THEIR FABRICATION

Advanced Multilayered Coreless Support Structures and their Fabrica...

Novel integrated circuit support structures and their fabrication