Dun-Nian Yaung

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor with overlap of backside trench isolation structure an...
- Patent number 12,255,219
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure with high via density
- Patent number 12,224,298
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor and method of manufacturing the same
- Patent number 12,218,165
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image-sensing structure and method for forming the same
- Patent number 12,218,164
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CSI with controllable isolation structure and methods of manufactur...
- Patent number 12,218,166
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extra doped region for back-side deep trench isolation
- Patent number 12,211,876
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having a gate dielectric structure for improved device...
- Patent number 12,191,336
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for CMOS image sensors including through-substrat...
- Patent number 12,176,370
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,154,927
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite BSI structure and method of manufacturing the same
- Patent number 12,148,782
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,148,781
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside structure for image sensor
- Patent number 12,062,679
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method
- Patent number 12,057,446
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 12,040,336
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside capacitor techniques
- Patent number 12,034,037
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside or frontside through substrate via (TSV) landing on metal
- Patent number 12,033,919
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrodes with notches and methods for forming the same
- Patent number 12,009,214
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,996,433
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
- Patent number 11,984,465
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for via last through-vias
- Patent number 11,978,758
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming image-sensor device with deep-trench isolati...
- Patent number 11,973,101
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,428
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and methods of fabricating thereof
- Patent number 11,942,368
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20250105098
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING A GATE DIELECTRIC STRUCTURE FOR IMPROVED DEVICE...
- Publication number 20250098353
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Jui Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD
- Publication number 20250072135
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS
- Publication number 20250048658
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME
- Publication number 20250022912
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...
- Publication number 20250014987
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS
- Publication number 20250015124
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pixel Structures in Image Sensors
- Publication number 20250006762
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429129
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240395843
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE WITH HIGH VIA DENSITY
- Publication number 20240387591
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTUR...
- Publication number 20240379710
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...
- Publication number 20240379711
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA LANDING ON FRONT END OF LINE STRUCTURE
- Publication number 20240379500
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240379528
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371904
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE STRUCTURE FOR IMAGE SENSOR
- Publication number 20240363664
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS
- Publication number 20240355859
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT
- Publication number 20240355860
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240355815
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL
- Publication number 20240355710
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD
- Publication number 20240347576
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CAPACITOR TECHNIQUES
- Publication number 20240347582
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY
- Publication number 20240339467
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL SHIELDING FOR INTEGRATED CIRCUITS
- Publication number 20240339475
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS
- Publication number 20240332333
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20240313010
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Dun-Nian Yaung

Person

Patents Grantslast 30 patents

Image sensor with overlap of backside trench isolation structure an...

Shield structure for backside through substrate vias (TSVs)

Bond pad structure with high via density

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor image sensor and method of manufacturing the same

Semiconductor image-sensing structure and method for forming the same

CSI with controllable isolation structure and methods of manufactur...

Extra doped region for back-side deep trench isolation

Oversized via as through-substrate-via (TSV) stop layer

Image sensor having a gate dielectric structure for improved device...

Stacked structure for CMOS image sensors including through-substrat...

Semiconductor structure

High capacitance MIM device with self aligned spacer

Composite BSI structure and method of manufacturing the same

Image sensor device

Integrated chip for standard logic performance improvement having a...

Stacked semiconductor structure and method

Backside structure for image sensor

Stacked semiconductor device and method

Semiconductor imaging device having improved dark current performance

Backside capacitor techniques

Backside or frontside through substrate via (TSV) landing on metal

Gate electrodes with notches and methods for forming the same

Hybrid bonding with uniform pattern density

Pad structure for front side illuminated image sensor

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Methods and apparatus for via last through-vias

Mechanisms for forming image-sensor device with deep-trench isolati...

Semiconductor structure and manufacturing method thereof

Through silicon vias and methods of fabricating thereof

Patents Applicationslast 30 patents

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

IMAGE SENSOR HAVING A GATE DIELECTRIC STRUCTURE FOR IMPROVED DEVICE...

IMAGE SENSOR DEVICE AND METHOD

CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS

HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

METAL-INSULATOR-METAL CAPACITORS

Pixel Structures in Image Sensors

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

BOND PAD STRUCTURE WITH HIGH VIA DENSITY

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTUR...

SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...

THROUGH SUBSTRATE VIA LANDING ON FRONT END OF LINE STRUCTURE

METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE

COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME

BACKSIDE STRUCTURE FOR IMAGE SENSOR

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS

ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT

STACKED SEMICONDUCTOR DEVICE AND METHOD

BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL

SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD

BACKSIDE CAPACITOR TECHNIQUES

ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY

SIGNAL SHIELDING FOR INTEGRATED CIRCUITS

BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE