Duy-Loan T. Le

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Sugar Land, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Controlling flip-chip techniques for concurrent ball bonds in semic...
- Patent number 7,776,653
- Issue date Aug 17, 2010
- Texas Instruments Incorporated
- David N. Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling flip-chip techniques for concurrent ball bonds in semic...
- Patent number 7,573,137
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- David N. Walter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semic...
- Publication number 20090269883
- Publication date Oct 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- David N. Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semic...
- Publication number 20070228543
- Publication date Oct 4, 2007
- TEXAS INSTRUMENTS INCORPORATED
- David N. Walter
- H01 - BASIC ELECTRIC ELEMENTS