Dyer A. Matlock

Person

Melbourne, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for forming twin well CMOS integrated circuits
- Patent number 5,429,958
- Issue date Jul 4, 1995
- Harris Corporation
- Dyer A. Matlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming twin well CMOS integrated circuits
- Patent number 5,247,199
- Issue date Sep 21, 1993
- Harris Corporation
- Dyer A. Matlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming extremely thin edge-connectable integrated circ...
- Patent number 5,185,292
- Issue date Feb 9, 1993
- Harris Corporation
- Nicolaas W. VanVonno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming extremely thin integrated circuit dice
- Patent number 5,071,792
- Issue date Dec 10, 1991
- Harris Corporation
- Nicolaas W. VanVonno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for elimination of polysilicon stringers in direct moat f...
- Patent number 4,908,683
- Issue date Mar 13, 1990
- Harris Corporation
- Dyer A. Matlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS device having reduced spacing between N and P channel
- Patent number 4,829,359
- Issue date May 9, 1989
- Harris Corp.
- Kenneth K. O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming planarized interconnect level using selective de...
- Patent number 4,814,285
- Issue date Mar 21, 1989
- Harris Corp.
- Dyer A. Matlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of ensuring adhesion of chemically vapor deposited oxide to...
- Patent number 4,716,071
- Issue date Dec 29, 1987
- Harris Corporation
- Bruce E. Roberts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of ensuring adhesion of chemically vapor deposited oxide to...
- Patent number 4,713,260
- Issue date Dec 15, 1987
- Harris Corporation
- Bruce E. Roberts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Technique for elimination of polysilicon stringers in direct moat f...
- Patent number 4,702,000
- Issue date Oct 27, 1987
- Harris Corporation
- Dyer A. Matlock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodeposition of submicrometer metallic interconnect for integr...
- Patent number 4,624,749
- Issue date Nov 25, 1986
- Harris Corporation
- Jimmy C. Black
- H01 - BASIC ELECTRIC ELEMENTS

Dyer A. Matlock

Person

Patents Grantslast 30 patents

Process for forming twin well CMOS integrated circuits

Process for forming twin well CMOS integrated circuits

Process for forming extremely thin edge-connectable integrated circ...

Process for forming extremely thin integrated circuit dice

Technique for elimination of polysilicon stringers in direct moat f...

CMOS device having reduced spacing between N and P channel

Method for forming planarized interconnect level using selective de...

Method of ensuring adhesion of chemically vapor deposited oxide to...

Method of ensuring adhesion of chemically vapor deposited oxide to...

Technique for elimination of polysilicon stringers in direct moat f...

Electrodeposition of submicrometer metallic interconnect for integr...