E-TUNG CHOU

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package apparatus and manufacturing method thereof
- Patent number 9,601,402
- Issue date Mar 21, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package apparatus and manufacturing method thereof
- Patent number 9,589,935
- Issue date Mar 7, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless package structure and method for manufacturing same
- Patent number 9,362,248
- Issue date Jun 7, 2016
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,357,647
- Issue date May 31, 2016
- Zhen Ding Technology Co., Ltd.
- Chu-Chin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,173,298
- Issue date Oct 27, 2015
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,165,790
- Issue date Oct 20, 2015
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate for mounting chip, method for manufacturing same...
- Patent number 8,951,848
- Issue date Feb 10, 2015
- Zhen Ding Technology Co., Ltd.
- E-Tung Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR EMI SHIELDING COMPONENT, SEMICONDUCTOR PACKAGE STRUCT...
- Publication number 20230048468
- Publication date Feb 16, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20160163677
- Publication date Jun 9, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20150382469
- Publication date Dec 31, 2015
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20150380391
- Publication date Dec 31, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20150235916
- Publication date Aug 20, 2015
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-TUNG CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150014849
- Publication date Jan 15, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140185259
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140117553
- Publication date May 1, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP P...
- Publication number 20140085833
- Publication date Mar 27, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- SHIH-PING HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140078706
- Publication date Mar 20, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140036465
- Publication date Feb 6, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE FOR MOUNTING CHIP, METHOD FOR MANUFACTURING SAME...
- Publication number 20140027893
- Publication date Jan 30, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- E-TUNG CHOU
- H01 - BASIC ELECTRIC ELEMENTS

E-TUNG CHOU

Person

Patents Grantslast 30 patents

Package apparatus and manufacturing method thereof

Package apparatus and manufacturing method thereof

Coreless package structure and method for manufacturing same

Packaging substrate, method for manufacturing same, and chip packag...

Packaging substrate, method for manufacturing same, and chip packag...

Packaging substrate, method for manufacturing same, and chip packag...

Circuit substrate for mounting chip, method for manufacturing same...

Patents Applicationslast 30 patents

SEMICONDUCTOR EMI SHIELDING COMPONENT, SEMICONDUCTOR PACKAGE STRUCT...

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

CORELESS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP P...

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

CIRCUIT SUBSTRATE FOR MOUNTING CHIP, METHOD FOR MANUFACTURING SAME...