Edgardo R. Hortaleza

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for laser assisted wirebonding
- Patent number 7,476,597
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for contact pads having a recessed bondable me...
- Patent number 7,351,651
- Issue date Apr 1, 2008
- Texas Instruments Incorporated
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for contact pads having a protected bondable m...
- Patent number 7,061,114
- Issue date Jun 13, 2006
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Undercut process with isotropic plasma etching at package level
- Patent number 6,686,291
- Issue date Feb 3, 2004
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat dissipating flip-chip ball grid array
- Patent number 6,657,311
- Issue date Dec 2, 2003
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled transducer-dual head bonder for optimum ultrasonic power app...
- Patent number 6,182,882
- Issue date Feb 6, 2001
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Balancing of x and y axis bonding by 45 degree capillary positioning
- Patent number 6,131,792
- Issue date Oct 17, 2000
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Angled transducer-dual head bonder for optimum ultrasonic power app...
- Patent number 6,112,973
- Issue date Sep 5, 2000
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Balancing of x and y axis bonding by 45 degree capillary positioning
- Patent number 6,089,443
- Issue date Jul 18, 2000
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature ball bonding
- Patent number 5,984,162
- Issue date Nov 16, 1999
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stitch bond enhancement for hard-to-bond materials
- Patent number 5,960,262
- Issue date Sep 28, 1999
- Texas Instruments Incorporated
- Orlando F. Torres
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING
- Publication number 20090029542
- Publication date Jan 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Willmar E. SUBIDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTEC...
- Publication number 20080111244
- Publication date May 15, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Glenn J. Tessmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems for Laser Assisted Wirebonding
- Publication number 20080009129
- Publication date Jan 10, 2008
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Re-enforced ball-grid array packages for semiconductor products
- Publication number 20070085220
- Publication date Apr 19, 2007
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced PGA Interconnection
- Publication number 20070013047
- Publication date Jan 18, 2007
- Edgardo R Hortaleza
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure and method for contact pads having an overcoat-protected...
- Publication number 20060094228
- Publication date May 4, 2006
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having a recessed bondable me...
- Publication number 20060082000
- Publication date Apr 20, 2006
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced PGA interconnection
- Publication number 20060022327
- Publication date Feb 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Edgardo R. Hortaleza
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structure and method for contact pads having a protected bondable m...
- Publication number 20050224984
- Publication date Oct 13, 2005
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having double overcoat-protec...
- Publication number 20050224987
- Publication date Oct 13, 2005
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having an overcoat-protected...
- Publication number 20050215048
- Publication date Sep 29, 2005
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for contact pads having a recessed bondable me...
- Publication number 20050206007
- Publication date Sep 22, 2005
- Lei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple die-spacer for an integrated circuit
- Publication number 20050161791
- Publication date Jul 28, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for increasing bump pad height
- Publication number 20040232562
- Publication date Nov 25, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Edgardo Rulloda Hortaleza
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Recessed-bond semiconductor package substrate
- Publication number 20040183167
- Publication date Sep 23, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folded tape area array package with one metal layer
- Publication number 20040012078
- Publication date Jan 22, 2004
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING FLIP-CHIP BALL GRID ARRAY
- Publication number 20030214049
- Publication date Nov 20, 2003
- Edgardo R. Hortaleza
- H01 - BASIC ELECTRIC ELEMENTS

Edgardo R. Hortaleza

Person

Patents Grantslast 30 patents

Methods and systems for laser assisted wirebonding

Structure and method for contact pads having a recessed bondable me...

Structure and method for contact pads having a protected bondable m...

Undercut process with isotropic plasma etching at package level

Heat dissipating flip-chip ball grid array

Angled transducer-dual head bonder for optimum ultrasonic power app...

Balancing of x and y axis bonding by 45 degree capillary positioning

Angled transducer-dual head bonder for optimum ultrasonic power app...

Balancing of x and y axis bonding by 45 degree capillary positioning

Room temperature ball bonding

Stitch bond enhancement for hard-to-bond materials

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTEC...

Methods and Systems for Laser Assisted Wirebonding

Re-enforced ball-grid array packages for semiconductor products

Enhanced PGA Interconnection

Structure and method for contact pads having an overcoat-protected...

Structure and method for contact pads having a recessed bondable me...

Enhanced PGA interconnection

Structure and method for contact pads having a protected bondable m...

Structure and method for contact pads having double overcoat-protec...

Structure and method for contact pads having an overcoat-protected...

Structure and method for contact pads having a recessed bondable me...

Multiple die-spacer for an integrated circuit

System and method for increasing bump pad height

Recessed-bond semiconductor package substrate

Folded tape area array package with one metal layer

HEAT DISSIPATING FLIP-CHIP BALL GRID ARRAY