Edgardo Rulloda Hortaleza

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Baguio City, PH

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Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE
- Publication number 20120199960
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- GLENN ENRICK CALDERON COSUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-DISPENSE VACUUM OVEN FOR REDUCING UNDERFILL VOIDS DURING IC AS...
- Publication number 20110300673
- Publication date Dec 8, 2011
- TEXAS INSTRUMENTS INCORPORATED
- EMORY TONGOL MERCADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermediate Bond Pad for Stacked Semiconductor Chip Package
- Publication number 20090206460
- Publication date Aug 20, 2009
- Elaine Bautista Reyes
- H01 - BASIC ELECTRIC ELEMENTS