Edmond Otto Fey

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a printed wiring board with conformally plated cir...
- Patent number 7,378,227
- Issue date May 27, 2008
- International Business Machines Corporation
- Edmond Otto Fey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
- Patent number 6,931,722
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accelerated etching of chromium
- Patent number 6,843,929
- Issue date Jan 18, 2005
- International Business Machines Corporation
- Donald S. Farquhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board with conformally plated circuit traces
- Patent number 6,815,126
- Issue date Nov 9, 2004
- International Business Machines Corporation
- Edmond Otto Fey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball with chemically and mechanically enhanced surface prope...
- Patent number 6,607,613
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
- Patent number 6,586,683
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for removal of undesirable conductive material on a circuit...
- Patent number 6,544,584
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Edward Lee Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning a layered chrome-copper structure disposed on a dielectr...
- Patent number 6,335,495
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced solder surface and process for chemically and mechanically...
- Patent number 6,210,547
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for removal of undersirable conductive material on a circui...
- Patent number 6,063,481
- Issue date May 16, 2000
- International Business Machines Corporation
- Edward Lee Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for chemically and mechanically enhancing solder surface pr...
- Patent number 6,056,831
- Issue date May 2, 2000
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of controlling the spread of an adhesive on a circuitized or...
- Patent number 6,046,500
- Issue date Apr 4, 2000
- International Business Machines Corporation
- Edmond Otto Fey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of controlling the spread of an adhesive on a circuitized or...
- Patent number 5,910,341
- Issue date Jun 8, 1999
- International Business Machines Corporation
- Edmond Otto Fey
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methyl chloroform-free desmear process in additive circuitization
- Patent number 5,311,660
- Issue date May 17, 1994
- International Business Machines Corporation
- Warren A. Alpaugh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless plating with bi-level control of dissolved oxygen, with...
- Patent number 4,967,690
- Issue date Nov 6, 1990
- International Business Machines Corporation
- Edmond O. Fey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating with bi-level control of dissolved oxygen
- Patent number 4,684,545
- Issue date Aug 4, 1987
- International Business Machines Corporation
- Edmond O. Fey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrochromic printing
- Patent number 4,444,626
- Issue date Apr 24, 1984
- International Business Machines Corporation
- William E. Bernier
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Treatment of copper and use thereof
- Patent number 4,358,479
- Issue date Nov 9, 1982
- International Business Machines Corporation
- Michael J. Canestaro
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of making a printed wiring board with conformally plated cir...
- Publication number 20050058945
- Publication date Mar 17, 2005
- International Business Machines Corporation
- Edmond Otto Fey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed wiring board with conformally plated circuit traces
- Publication number 20030188886
- Publication date Oct 9, 2003
- International Business Machines Corporation
- Edmond Otto Fey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20030177635
- Publication date Sep 25, 2003
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20020157861
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Edward L. Arrington
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Solder ball with chemically and mechanically enhanced surface prope...
- Publication number 20010012570
- Publication date Aug 9, 2001
- Frank D. Egitto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Edmond Otto Fey

Person

Patents Grantslast 30 patents

Method of making a printed wiring board with conformally plated cir...

Method of fabricating printed circuit board with mixed metallurgy pads

Accelerated etching of chromium

Printed wiring board with conformally plated circuit traces

Solder ball with chemically and mechanically enhanced surface prope...

Printed circuit board with mixed metallurgy pads and method of fabr...

Process for removal of undesirable conductive material on a circuit...

Patterning a layered chrome-copper structure disposed on a dielectr...

Enhanced solder surface and process for chemically and mechanically...

Process for removal of undersirable conductive material on a circui...

Process for chemically and mechanically enhancing solder surface pr...

Method of controlling the spread of an adhesive on a circuitized or...

Method of controlling the spread of an adhesive on a circuitized or...

Methyl chloroform-free desmear process in additive circuitization

Electroless plating with bi-level control of dissolved oxygen, with...

Electroless plating with bi-level control of dissolved oxygen

Electrochromic printing

Treatment of copper and use thereof

Patents Applicationslast 30 patents

Method of making a printed wiring board with conformally plated cir...

Printed wiring board with conformally plated circuit traces

Printed circuit board with mixed metallurgy pads and method of fabr...

Printed circuit board with mixed metallurgy pads and method of fabr...

Solder ball with chemically and mechanically enhanced surface prope...