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Edmund J. Sobresky
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Batavia, NY, US
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Patents Grants
last 30 patents
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Patent Grant
Method of manufacturing an extruded, tiered high fin density heat sink
Patent number
6,138,352
Issue date
Oct 31, 2000
Eastman Kodak Company
Dean L. Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Extruded, tiered high fin density heat sinks and method of manufacture
Patent number
6,050,332
Issue date
Apr 18, 2000
Eastman Kodak Company
Dean L. Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Extruded, tiered high fin density heat sinks and method of manufacture
Patent number
6,009,938
Issue date
Jan 4, 2000
Eastman Kodak Company
Dean L. Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat exchanger having an extruded, tiered heat sink
Patent number
5,995,367
Issue date
Nov 30, 1999
Eastman Kodak Company
Dean L. Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded cast, pin-finned heat sink and method of manufacture
Patent number
5,988,266
Issue date
Nov 23, 1999
Eastman Kodak Company
Dean L. Smith
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Method of manufacturing bonded dual extruded, high fin density heat...
Patent number
5,937,517
Issue date
Aug 17, 1999
Eastman Kodak Company
Dean L. Smith
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonded cast, pin-finned heat sink and method of manufacture
Patent number
5,829,514
Issue date
Nov 3, 1998
Eastman Kodak Company
Dean L. Smith
F28 - HEAT EXCHANGE IN GENERAL