Claims
- 1. A heat sink, comprising:
- a first base member having a plurality of spaced, substantially parallel first pin fins, each of said first pin fins having a first lead end extending substantially perpendicular from a common first face of said first base member;
- a second opposing base member having a plurality of spaced, substantially parallel second pin fins, each of said second fins having a second lead end extending substantially perpendicular from a common second face of said second base member, wherein said plurality of second pin fins of said common second face are configured to mate with said common first face of said first base member, and wherein said plurality of first pin fins of said first base member are configured to mate with said common second face of said second opposing base member;
- a plurality of first recesses formed in said common first face, each one of said plurality of first recesses being provided for receiving one of said second lead end associated with a corresponding one of said plurality of spaced second pin fins, each one of said plurality of first recesses having a first bottom wall and first sidewalls surrounding said bottom wall;
- a plurality of second recesses formed in said common second face, each one of said plurality of second recesses being provided for receiving one of said first lead end associated with a corresponding one of said plurality of spaced first pin fins in a spaced relations with said first fins, each one of said second recesses having a second bottom wall and second sidewalls surrounding said second bottom wall; and,
- means for fixing at least a portion of said plurality of first pin fins against movement in a corresponding one of said plurality of second recesses such that said first lead end associated with a corresponding one of said plurality of first pin fins abuts against the second bottom wall of one of said second plurality of recesses, wherein remaining ones of said plurality of first pin fins abut against said first common face of said second opposing base member; and means for fixing at least a portion of said plurality of second pin fins against movement in a corresponding one of said plurality of first recesses such that said second lead end associated with a corresponding one of said plurality of second pin fins abuts against the first bottom wall of one of said first plurality of recesses, wherein remaining ones of said plurality of second pin fins abut against said common face of said first opposing base member; and wherein each one of said plurality of first pin fins nearest adjacent to any one of said plurality of second pin fins forms a narrow fluid passageway therebetween.
- 2. The heat sink recited in claim 1 wherein said first lead end of said plurality of first pin fins is bonded to a respective second bottom wall of one of said plurality of second recesses with an epoxy resin; and wherein said second lead end of said plurality of second pin fins is bonded to a respective first bottom wall of one of said plurality of first recesses with said epoxy resin.
- 3. The heat sink recited in claim 1, wherein each of said plurality of first and second pin fins has a generally cylindrical shape.
- 4. The heat sink recited in claim 1, wherein said first and second base members are made from a nonferrous material.
- 5. The heat sink recited in claim 1, wherein said first and second base members comprise materials selected from the group consisting of:
- (a) aluminum alloys;
- (b) zinc alloys;
- (c) magnesium alloys;
- (d) copper alloys; and,
- (e) mixtures thereof.
- 6. The heat sink recited in claim 1, wherein each one of said plurality of first and second recesses and each one of said plurality of first and second pin fins include a chamfered end edge for guiding each one of said first and second lead ends into one of said plurality of first and second recesses, respectively.
Parent Case Info
This Appln is a Div of Ser. No. 08/959,692 Oct. 29, 1997, now U.S. Pat. No. 5,829,514.
US Referenced Citations (12)
Foreign Referenced Citations (1)
Number |
Date |
Country |
199736 |
Jul 1992 |
JPX |
Non-Patent Literature Citations (1)
Entry |
catalogue material--Augmented Surface Bonded Heat Sinks published by AAVID.TM. Thermal Technologies, Inc. (Mar. 1996). |
Divisions (1)
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Number |
Date |
Country |
Parent |
959692 |
Oct 1997 |
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