Edmund Low Kwok Chung

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic component assemblies with recessed wire bonds and m...
- Patent number 7,365,424
- Issue date Apr 29, 2008
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component assemblies with recessed wire bonds and m...
- Patent number 7,250,328
- Issue date Jul 31, 2007
- Micron Technology, Inc.
- Erin Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC COMPONENT ASSEMBLIES WITH RECESSED WIRE BONDS AND M...
- Publication number 20080164591
- Publication date Jul 10, 2008
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic component assemblies with recessed wire bonds and m...
- Publication number 20060208366
- Publication date Sep 21, 2006
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS