Edward A. Schrock

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,222,868
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device wafers and methods of manufacturing
- Patent number 8,455,983
- Issue date Jun 4, 2013
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic device wafers and methods of manufacturing
- Patent number 8,062,958
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for epoxy loc die attachment
- Patent number 7,220,616
- Issue date May 22, 2007
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming stencil
- Patent number 7,213,331
- Issue date May 8, 2007
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
- Patent number 7,153,788
- Issue date Dec 26, 2006
- Micron Technology, Inc.
- Ed Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for epoxy LOC die attachment
- Patent number 7,115,976
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a flexible substrate with a filler material
- Patent number 7,071,030
- Issue date Jul 4, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for epoxy loc die attachment
- Patent number 6,858,469
- Issue date Feb 22, 2005
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BGA package having substrate with patterned solder mask defining op...
- Patent number 6,825,569
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interposer for BGA packages
- Patent number 6,770,981
- Issue date Aug 3, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for attaching a semiconductor die to a substrate
- Patent number 6,770,164
- Issue date Aug 3, 2004
- Micron Technology, Inc.
- Edward A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for epoxy loc die attachment
- Patent number 6,719,550
- Issue date Apr 13, 2004
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for use in packaging applications using an adhesive composi...
- Patent number 6,709,896
- Issue date Mar 23, 2004
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interposer for BGA packages
- Patent number 6,710,456
- Issue date Mar 23, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electrical conductor system, and method of ma...
- Patent number 6,707,152
- Issue date Mar 16, 2004
- Micron Technology, Inc.
- Edward A. Schrock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition for use in packaging applications
- Patent number 6,699,928
- Issue date Mar 2, 2004
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Z-axis electrical contact for microelectric devices
- Patent number 6,662,440
- Issue date Dec 16, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition and methods for use in packaging applications
- Patent number 6,646,354
- Issue date Nov 11, 2003
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Z-axis electrical contact for microelectronic devices
- Patent number 6,616,864
- Issue date Sep 9, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for attaching a workpiece to a workpiece support
- Patent number 6,562,277
- Issue date May 13, 2003
- Micron Technology, Inc.
- Ed Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered adhesive for attaching a semiconductor die to a subst...
- Patent number 6,541,872
- Issue date Apr 1, 2003
- Micron Technology, Inc.
- Edward A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling packaging encapsulant leakage
- Patent number 6,521,980
- Issue date Feb 18, 2003
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling packaging encapsulant leakage
- Patent number 6,395,579
- Issue date May 28, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for epoxy loc die attachment
- Patent number 6,352,422
- Issue date Mar 5, 2002
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrical conductor system for semiconductor device
- Patent number 6,352,925
- Issue date Mar 5, 2002
- Micron Technology, Inc.
- Edward A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die attachment method and apparatus
- Patent number 6,353,268
- Issue date Mar 5, 2002
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for use in packaging applications
- Patent number 6,339,259
- Issue date Jan 15, 2002
- Micron Technology, Inc.
- Chad A. Cobbley
Information Patent Grant
Method and system for attaching semiconductor dice to substrates
- Patent number 6,221,691
- Issue date Apr 24, 2001
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES
- Publication number 20220102317
- Publication date Mar 31, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES
- Publication number 20180012865
- Publication date Jan 11, 2018
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING
- Publication number 20120070959
- Publication date Mar 22, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING
- Publication number 20100252915
- Publication date Oct 7, 2010
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating chip-scale packages having carrier bonds
- Publication number 20070166882
- Publication date Jul 19, 2007
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for attaching a workpiece to a workpiece support
- Publication number 20070095280
- Publication date May 3, 2007
- Ed Schrock
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods for epoxy loc die attachment
- Publication number 20050079653
- Publication date Apr 14, 2005
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Z-axis electrical contact for microelectronic devices
- Publication number 20040078967
- Publication date Apr 29, 2004
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for attaching a workpiece to a workpiece support
- Publication number 20030178475
- Publication date Sep 25, 2003
- Ed Schrock
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composite interposer for BGA packages
- Publication number 20030164556
- Publication date Sep 4, 2003
- TONGBI JIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a flexible substrate with a filler material
- Publication number 20030153099
- Publication date Aug 14, 2003
- TONGBI JIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION FOR USE IN PACKAGING APPLICATIONS
- Publication number 20030122226
- Publication date Jul 3, 2003
- CHAD A. COBBLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Fabricating Chip-Scale Packages And Resulting Structures
- Publication number 20020125568
- Publication date Sep 12, 2002
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for epoxy loc die attachment
- Publication number 20020069972
- Publication date Jun 13, 2002
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive composition for use in packaging applications
- Publication number 20020068379
- Publication date Jun 6, 2002
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA Package Having Substrate With Patterned Solder Mask Defining Op...
- Publication number 20010013642
- Publication date Aug 16, 2001
- TONGBI JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling packaging encapsulant leakage
- Publication number 20010008780
- Publication date Jul 19, 2001
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS

Edward A. Schrock

Person

Patents Grantslast 30 patents

Thermal transfer structures for semiconductor die assemblies

Thermal transfer structures for semiconductor die assemblies

Microelectronic device wafers and methods of manufacturing

Microelectronic device wafers and methods of manufacturing

Methods for epoxy loc die attachment

Method for forming stencil

Method and apparatus for attaching a workpiece to a workpiece support

Method and apparatus for epoxy LOC die attachment

Method of making a flexible substrate with a filler material

Method and apparatus for epoxy loc die attachment

BGA package having substrate with patterned solder mask defining op...

Composite interposer for BGA packages

Method for attaching a semiconductor die to a substrate

Apparatus for epoxy loc die attachment

Methods for use in packaging applications using an adhesive composi...

Composite interposer for BGA packages

Semiconductor device, electrical conductor system, and method of ma...

Adhesive composition for use in packaging applications

Z-axis electrical contact for microelectric devices

Adhesive composition and methods for use in packaging applications

Z-axis electrical contact for microelectronic devices

Method and apparatus for attaching a workpiece to a workpiece support

Multi-layered adhesive for attaching a semiconductor die to a subst...

Controlling packaging encapsulant leakage

Controlling packaging encapsulant leakage

Method and apparatus for epoxy loc die attachment

Method of making electrical conductor system for semiconductor device

Semiconductor die attachment method and apparatus

Adhesive composition for use in packaging applications

Method and system for attaching semiconductor dice to substrates

Patents Applicationslast 30 patents

THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES

THERMAL TRANSFER STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES

MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING

MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING

Methods for fabricating chip-scale packages having carrier bonds

Method and apparatus for attaching a workpiece to a workpiece support

Methods for epoxy loc die attachment

Z-axis electrical contact for microelectronic devices

Method and apparatus for attaching a workpiece to a workpiece support

Composite interposer for BGA packages

Method of making a flexible substrate with a filler material

ADHESIVE COMPOSITION FOR USE IN PACKAGING APPLICATIONS

Method Of Fabricating Chip-Scale Packages And Resulting Structures

Method and apparatus for epoxy loc die attachment

Adhesive composition for use in packaging applications

BGA Package Having Substrate With Patterned Solder Mask Defining Op...

Controlling packaging encapsulant leakage