“Area Tape Automated Bonding Ball Grid Array Technology” by Chin-Ching Huang and Ahmad Hamzehdoost, Ball Grid Array Technology, Chapter 14, pp. 443-464 (1995). |
“Face-down BGA shrinks memory products by 75%”, by Spencer Chin, Outlook. |
“Tessera's Micro-Ball Grid Array (μBGA)”, Chapter 16, pp. 259-282. |
“Advanced Encapsulant Systems for Flip-Chip-on-Board Assemblies: Underfills with Improved manufacturing Properties” by Daniel R. Gamota and Cindy M. Melton, IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part C, vol. 21, No. 3, Jul. 1998. |