Edward C. Cooney, III

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 8,343,868
- Issue date Jan 1, 2013
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Copper alloy via bottom liner
- Patent number 8,294,270
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Daniel C. Edelstein
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrostatic chucking of an insulator handle substrate
- Patent number 8,242,591
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing effective dielectric constant in semiconductor devices
- Patent number 8,129,286
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
By-product collecting processes for cleaning processes
- Patent number 8,052,799
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for interfacial adhesion in laminate structures through pat...
- Patent number 7,972,965
- Issue date Jul 5, 2011
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,892,940
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Metal seed layer deposition
- Patent number 7,879,716
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Steven P Barkyoumb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via including variable sidewall profile
- Patent number 7,863,180
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-modified device structures, methods of fabricating such stre...
- Patent number 7,843,039
- Issue date Nov 30, 2010
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal tungsten through wafer via and process of fabricating same
- Patent number 7,741,226
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structures having different materials f...
- Patent number 7,704,876
- Issue date Apr 27, 2010
- International Business Machines Corporation
- Jeffrey Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spacer in single and dual damascene processing
- Patent number 7,655,547
- Issue date Feb 2, 2010
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,592,685
- Issue date Sep 22, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pore sealing post patterning
- Patent number 7,541,679
- Issue date Jun 2, 2009
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing foreign material concentrations in etch chambers
- Patent number 7,517,802
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,405,147
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial metal spacer damascene process
- Patent number 7,393,777
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spacer in single and dual damascence processing
- Patent number 7,381,637
- Issue date Jun 3, 2008
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy via bottom liner
- Patent number 7,327,033
- Issue date Feb 5, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for interfacial adhesion in laminate structures through pat...
- Patent number 7,303,994
- Issue date Dec 4, 2007
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structures having different materials f...
- Patent number 7,300,867
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Jeffrey Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal seed layer deposition
- Patent number 7,235,487
- Issue date Jun 26, 2007
- International Business Machines Corporation
- Steven P Barkyoumb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing foreign material concentrations in etch chambers
- Patent number 7,192,874
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper to aluminum interlayer interconnect using stud and via liner
- Patent number 7,087,997
- Issue date Aug 8, 2006
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for selectively altering dielectric properties...
- Patent number 7,045,472
- Issue date May 16, 2006
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper to aluminum interlayer interconnect using stud and via liner
- Patent number 7,037,824
- Issue date May 2, 2006
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pore sealing post patterning
- Patent number 7,015,150
- Issue date Mar 21, 2006
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multilevel rework
- Patent number 6,982,227
- Issue date Jan 3, 2006
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structures having different materials f...
- Patent number 6,958,540
- Issue date Oct 25, 2005
- International Business Machines Corporation
- Jeffrey Gambino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CORNER-ROUNDED STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20120319237
- Publication date Dec 20, 2012
- International Business Machines Corporation
- Edward C. COONEY, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKING OF AN INSULATOR HANDLE SUBSTRATE
- Publication number 20120193790
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, STRUCTURES, AND DESIGN STRUCTURES FOR IMPROVED ADHESION OF...
- Publication number 20120018832
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Edward C. COONEY, III
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER ALLOY VIA BOTTOM LINER
- Publication number 20110227225
- Publication date Sep 22, 2011
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20110111590
- Publication date May 12, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE
- Publication number 20110068477
- Publication date Mar 24, 2011
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKING OF AN INSULATOR HANDLE SUBSTRATE
- Publication number 20110037161
- Publication date Feb 17, 2011
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS...
- Publication number 20100263998
- Publication date Oct 21, 2010
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMAL TUNGSTEN THROUGH WAFER VIA AND PROCESS OF FABRICATING SAME
- Publication number 20090280643
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE
- Publication number 20090278237
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...
- Publication number 20090212434
- Publication date Aug 27, 2009
- Felix P. Anderson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRESS-MODIFIED DEVICE STRUCTURES, METHODS OF FABRICATING SUCH STRE...
- Publication number 20090206449
- Publication date Aug 20, 2009
- Edward C. Cooney III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SPACER IN SINGLE AND DUAL DAMASCENE PROCESSING
- Publication number 20080293242
- Publication date Nov 27, 2008
- International Business Machiness Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY VIA BOTTOM LINER
- Publication number 20060027930
- Publication date Feb 9, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING FOREIGN MATERIAL CONCENTRATIONS IN ETCH CHAMBERS
- Publication number 20050014369
- Publication date Jan 20, 2005
- International Business Machines Corporation
- Edward Crandal Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS F...
- Publication number 20040262764
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS

Edward C. Cooney, III

Person

Patents Grantslast 30 patents

Device and methodology for reducing effective dielectric constant i...

Copper alloy via bottom liner

Electrostatic chucking of an insulator handle substrate

Reducing effective dielectric constant in semiconductor devices

By-product collecting processes for cleaning processes

Process for interfacial adhesion in laminate structures through pat...

Device and methodology for reducing effective dielectric constant i...

Metal seed layer deposition

Through substrate via including variable sidewall profile

Stress-modified device structures, methods of fabricating such stre...

Optimal tungsten through wafer via and process of fabricating same

Dual damascene interconnect structures having different materials f...

Metal spacer in single and dual damascene processing

Device and methodology for reducing effective dielectric constant i...

Exposed pore sealing post patterning

Method for reducing foreign material concentrations in etch chambers

Device and methodology for reducing effective dielectric constant i...

Sacrificial metal spacer damascene process

Metal spacer in single and dual damascence processing

Copper alloy via bottom liner

Process for interfacial adhesion in laminate structures through pat...

Dual damascene interconnect structures having different materials f...

Metal seed layer deposition

Method for reducing foreign material concentrations in etch chambers

Copper to aluminum interlayer interconnect using stud and via liner

Method and apparatus for selectively altering dielectric properties...

Copper to aluminum interlayer interconnect using stud and via liner

Exposed pore sealing post patterning

Single and multilevel rework

Dual damascene interconnect structures having different materials f...

Patents Applicationslast 30 patents

CORNER-ROUNDED STRUCTURES AND METHODS OF MANUFACTURE

ELECTROSTATIC CHUCKING OF AN INSULATOR HANDLE SUBSTRATE

METHODS, STRUCTURES, AND DESIGN STRUCTURES FOR IMPROVED ADHESION OF...

COPPER ALLOY VIA BOTTOM LINER

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE

ELECTROSTATIC CHUCKING OF AN INSULATOR HANDLE SUBSTRATE

VERTICAL INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS...

OPTIMAL TUNGSTEN THROUGH WAFER VIA AND PROCESS OF FABRICATING SAME

THROUGH SUBSTRATE VIA INCLUDING VARIABLE SIDEWALL PROFILE

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...

STRESS-MODIFIED DEVICE STRUCTURES, METHODS OF FABRICATING SUCH STRE...

METAL SPACER IN SINGLE AND DUAL DAMASCENE PROCESSING

COPPER ALLOY VIA BOTTOM LINER

METHOD FOR REDUCING FOREIGN MATERIAL CONCENTRATIONS IN ETCH CHAMBERS

DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS F...