Edward Furgut

Person

Dasing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component with electronic chip between redistribution st...
- Patent number 9,385,111
- Issue date Jul 5, 2016
- Infineon Technologies Austria AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including electronic component coupled to a ba...
- Patent number 8,350,382
- Issue date Jan 8, 2013
- Infineon Technologies AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor wafer, and method for produc...
- Patent number 7,420,262
- Issue date Sep 2, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH RECESS FOR BALANCING CREEPAGE CURRENT PATHS
- Publication number 20250038082
- Publication date Jan 30, 2025
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Package With Galvanic Isolation
- Publication number 20250014971
- Publication date Jan 9, 2025
- Infineon Technologies Austria AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...
- Publication number 20240266237
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...
- Publication number 20240243092
- Publication date Jul 18, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER CIRCUIT AND POWER SWITCHING ASSEMBLY WITH GATE DRIVER C...
- Publication number 20240113705
- Publication date Apr 4, 2024
- Infineon Technologies Austria AG
- Anton Mauder
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20240113026
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package or a Printed Circuit Board, Both Modified to...
- Publication number 20240014104
- Publication date Jan 11, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESIO...
- Publication number 20230378011
- Publication date Nov 23, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED...
- Publication number 20230360929
- Publication date Nov 9, 2023
- Infineon Technologies Austria AG
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...
- Publication number 20230361009
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING T...
- Publication number 20230282591
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE
- Publication number 20230282608
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...
- Publication number 20230274996
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ELECTRONIC COMPONENT COUPLED TO A BA...
- Publication number 20090079065
- Publication date Mar 26, 2009
- INFINEON TECHNOLOGIES AG
- Edward Furgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and semiconductor wafer, and method for produc...
- Publication number 20040207049
- Publication date Oct 21, 2004
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Edward Furgut

Person

Patents Grantslast 30 patents

Electronic component with electronic chip between redistribution st...

Semiconductor device including electronic component coupled to a ba...

Electronic component and semiconductor wafer, and method for produc...

Patents Applicationslast 30 patents

PACKAGE WITH RECESS FOR BALANCING CREEPAGE CURRENT PATHS

Power Package With Galvanic Isolation

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...

SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...

GATE DRIVER CIRCUIT AND POWER SWITCHING ASSEMBLY WITH GATE DRIVER C...

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

Semiconductor Package or a Printed Circuit Board, Both Modified to...

ELECTRONIC DEVICE MODULE AND A DEVICE MODULE BOTH HAVING AN ADHESIO...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED...

SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING T...

SEMICONDUCTOR DIE PACKAGE

CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...

SEMICONDUCTOR DEVICE INCLUDING ELECTRONIC COMPONENT COUPLED TO A BA...

Electronic component and semiconductor wafer, and method for produc...