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Edward K. Yung
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Carrboro, NC, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming differing volume solder bumps
Patent number
5,381,946
Issue date
Jan 17, 1995
MCNC
Nicholas G. Koopman
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus for testing, burn-in, and/or programming of integrated ci...
Patent number
5,374,893
Issue date
Dec 20, 1994
MCNC
Nicholas G. Koopman
G01 - MEASURING TESTING
Information
Patent Grant
Solder bump including circular lip
Patent number
5,293,006
Issue date
Mar 8, 1994
MCNC
Edward K. Yung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for testing, burn-in, and/or programming of integrated circu...
Patent number
5,289,631
Issue date
Mar 1, 1994
MCNC
Nicholas G. Koopman
G01 - MEASURING TESTING
Information
Patent Grant
Solder bump fabrication method
Patent number
5,162,257
Issue date
Nov 10, 1992
MCNC
Edward K. Yung
H01 - BASIC ELECTRIC ELEMENTS