This application is a division of application Ser. No. 07/845,996, filed Mar. 4, 1992, now U.S. Pat. No. 5,289,631.
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56-66057 | Jun 1981 | JPX |
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61-194744 | Aug 1986 | JPX |
63-58945 | Mar 1988 | JPX |
2247565 | Mar 1992 | GBX |
Entry |
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Decal Solder Transfer, R. J. Herdzik et al., IBM Technical Disclosure Bulletin, vol. 22, No. 3, Aug. 1979. |
Solder Rework Technique, R. J. Herdzik et al., IBM Technical Disclosure Bulletin, vol. 21, No. 12, May 1979. |
Method to Change Solder Composition of Chip, R. J. Herdzik et al., IBM Technical Disclosure Bulletin, vol. 22, No. 3, Aug. 1979. |
Solder Volume Optimization, R. J. Herdzik et al., IBM Technical Disclosure Bulletin, vol. 21, No. 12, May 1979. |
Terminal Metallurgy System For Semiconductor Devices, P. P. Castrucci et al., IBM Technical Disclosure Bulletin, vol. 9, No. 12, May 1967. |
Number | Date | Country | |
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Parent | 845996 | Mar 1992 |