Edward L. Martin

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfill device and method
- Patent number 9,516,752
- Issue date Dec 6, 2016
- Intel Corporation
- Patricia A Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underfill device and method
- Patent number 8,399,291
- Issue date Mar 19, 2013
- Intel Corporation
- Patricia A Brusso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-situ alloyed solders, articles made thereby, and processes of ma...
- Patent number 7,494,041
- Issue date Feb 24, 2009
- Intel Corporation
- Edward L. Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bumps formation using solder paste with shape retaining attr...
- Patent number 7,331,500
- Issue date Feb 19, 2008
- Intel Corporation
- Edward L. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
- Patent number 7,291,548
- Issue date Nov 6, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
- Patent number 7,253,088
- Issue date Aug 7, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having composite electronic contacts for attach...
- Patent number 7,053,491
- Issue date May 30, 2006
- Intel Corporation
- Edward L. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
UNDERFILL DEVICE AND METHOD
- Publication number 20130208411
- Publication date Aug 15, 2013
- Patricia A. Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER BUMPS FORMATION USING SOLDER PASTE WITH SHAPE RETAINING ATTR...
- Publication number 20080092991
- Publication date Apr 24, 2008
- Edward L. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated solder and heat spreader fabrication
- Publication number 20070035012
- Publication date Feb 15, 2007
- Carl L. Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill device and method
- Publication number 20070004085
- Publication date Jan 4, 2007
- Patricia A. Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stress-relief layers and stress-compensation collars with low-tempe...
- Publication number 20060068579
- Publication date Mar 30, 2006
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Low melting-point solders, articles made thereby, and processes of...
- Publication number 20060067852
- Publication date Mar 30, 2006
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Doped contact formations
- Publication number 20060060639
- Publication date Mar 23, 2006
- Tiffany A. Byrne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
In-situ alloyed solders, articles made thereby, and processes of ma...
- Publication number 20050284918
- Publication date Dec 29, 2005
- Edward L. Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder bumps formation using solder paste with shape retaining attr...
- Publication number 20050284920
- Publication date Dec 29, 2005
- Edward L. Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated solder and heat spreader fabrication
- Publication number 20050121776
- Publication date Jun 9, 2005
- Carl L. Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly having composite electronic contacts for attach...
- Publication number 20030146505
- Publication date Aug 7, 2003
- Edward L. Martin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Edward L. Martin

Person

Patents Grantslast 30 patents

Underfill device and method

Underfill device and method

In-situ alloyed solders, articles made thereby, and processes of ma...

Solder bumps formation using solder paste with shape retaining attr...

Stress-relief layers and stress-compensation collars with low-tempe...

Stress-relief layers and stress-compensation collars with low-tempe...

Electronic assembly having composite electronic contacts for attach...

Patents Applicationslast 30 patents

UNDERFILL DEVICE AND METHOD

SOLDER BUMPS FORMATION USING SOLDER PASTE WITH SHAPE RETAINING ATTR...

Integrated solder and heat spreader fabrication

Underfill device and method

Stress-relief layers and stress-compensation collars with low-tempe...

Low melting-point solders, articles made thereby, and processes of...

Doped contact formations

In-situ alloyed solders, articles made thereby, and processes of ma...

Solder bumps formation using solder paste with shape retaining attr...

Integrated solder and heat spreader fabrication

Electronic assembly having composite electronic contacts for attach...