Ehren Mannebach

Person

Tigard, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact resistance reduction in transistor devices with metallizati...
- Patent number 12,342,574
- Issue date Jun 24, 2025
- Intel Corporation
- Koustav Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sideways vias in isolation areas to contact interior layers in stac...
- Patent number 12,255,137
- Issue date Mar 18, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 12,230,635
- Issue date Feb 18, 2025
- Intel Corporation
- Nicole Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 12,224,202
- Issue date Feb 11, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked source-drain-gate connection and process for forming such
- Patent number 12,148,806
- Issue date Nov 19, 2024
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect techniques for electrically connecting source/drain re...
- Patent number 12,107,085
- Issue date Oct 1, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contacts for semiconductor devices
- Patent number 12,080,605
- Issue date Sep 3, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial layer with substantially parallel sides
- Patent number 12,020,929
- Issue date Jun 25, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leave-behind protective layer having secondary purpose
- Patent number 11,996,408
- Issue date May 28, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked forksheet transistors
- Patent number 11,996,411
- Issue date May 28, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sideways vias in isolation areas to contact interior layers in stac...
- Patent number 11,942,416
- Issue date Mar 26, 2024
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked source-drain-gate connection and process for forming such
- Patent number 11,916,118
- Issue date Feb 27, 2024
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked trigate transistors with dielectric isolation and process f...
- Patent number 11,894,372
- Issue date Feb 6, 2024
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 11,862,636
- Issue date Jan 2, 2024
- Intel Corporation
- Nicole Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 11,830,933
- Issue date Nov 28, 2023
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for semiconductor devices based on wafer bonding
- Patent number 11,798,838
- Issue date Oct 24, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including air gapping of gate spacers and other dielectrics...
- Patent number 11,769,814
- Issue date Sep 26, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 11,764,263
- Issue date Sep 19, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 11,764,104
- Issue date Sep 19, 2023
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect techniques for electrically connecting source/drain re...
- Patent number 11,742,346
- Issue date Aug 29, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistors having device strata with different channel widths
- Patent number 11,676,966
- Issue date Jun 13, 2023
- Intel Corporation
- Gilbert W. Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked memory elements with air gap
- Patent number 11,672,133
- Issue date Jun 6, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forksheet transistor architectures
- Patent number 11,664,377
- Issue date May 30, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked source-drain-gate connection and process for forming such
- Patent number 11,646,352
- Issue date May 9, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming gate structures for transistors arranged in...
- Patent number 11,616,060
- Issue date Mar 28, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuits with stacked transistors
- Patent number 11,605,565
- Issue date Mar 14, 2023
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked trigate transistors with dielectric isolation between first...
- Patent number 11,594,533
- Issue date Feb 28, 2023
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect with air gap
- Patent number 11,594,485
- Issue date Feb 28, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistors with different gate lengths in different device...
- Patent number 11,573,798
- Issue date Feb 7, 2023
- Intel Corporation
- Aaron D. Lilak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vertical memory cells
- Patent number 11,569,238
- Issue date Jan 31, 2023
- Intel Corporation
- Aaron Lilak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...
- Publication number 20250227956
- Publication date Jul 10, 2025
- Intel Corporation
- Koustav GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...
- Publication number 20250228008
- Publication date Jul 10, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED PENETRATIN...
- Publication number 20250227978
- Publication date Jul 10, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-CUT BACKSIDE SOURCE OR...
- Publication number 20250221040
- Publication date Jul 3, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...
- Publication number 20250221041
- Publication date Jul 3, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
BACKSIDE EPITAXIAL GROWTH FOR IMPROVED CONTACT AREA
- Publication number 20250220994
- Publication date Jul 3, 2025
- Intel Corporation
- Mauro J. Kobrinsky
Information Patent Application
FRONT SIDE AND BACKSIDE SOURCE OR DRAIN CONTACTS
- Publication number 20250220959
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH ASYMMETRIC EPITAXIAL SOURCE OR DR...
- Publication number 20250220978
- Publication date Jul 3, 2025
- Intel Corporation
- Gilbert DEWEY
Information Patent Application
DIRECTED SELF ASSEMBLY-ENABLED BACK-SIDE CONTACT ARRAYS ALIGNED TO...
- Publication number 20250218937
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH ASYMMETRIC SOURCE AND DRAIN CONTACTS
- Publication number 20250220950
- Publication date Jul 3, 2025
- Intel Corpration
- Gilbert Dewey
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...
- Publication number 20250220991
- Publication date Jul 3, 2025
- Intel Corporation
- Shao Ming KOH
Information Patent Application
SELF-ALIGNED BACK-SIDE GATE VIAS
- Publication number 20250218869
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED DEVICE CONTACTS AND THROUGH VIAS FOR PERFORMANCE AND L...
- Publication number 20250221020
- Publication date Jul 3, 2025
- Intel Corporation
- Sanjay Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED OXIDE AND SEAM-FIRST ETCH FOR AIR-GAPPED ISOLATION WALLS
- Publication number 20250210412
- Publication date Jun 26, 2025
- Intel Corporation
- Umang Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAPPED ISOLATION WALLS
- Publication number 20250210522
- Publication date Jun 26, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SOURCE/DRAIN TRANSISTOR CONTACT FLOW WITH SELECTIVE ETCH M...
- Publication number 20250113580
- Publication date Apr 3, 2025
- Intel Corporation
- Leonard Guler
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIFFERENTIATED SOURCE OR DRAIN ST...
- Publication number 20250107183
- Publication date Mar 27, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...
- Publication number 20250006568
- Publication date Jan 2, 2025
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...
- Publication number 20240429291
- Publication date Dec 26, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE PLUG LAST APPROACH
- Publication number 20240429294
- Publication date Dec 26, 2024
- Intel Corporation
- Shaun MILLS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT REVEAL UNIFORMITY
- Publication number 20240421153
- Publication date Dec 19, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT STITCHING
- Publication number 20240405085
- Publication date Dec 5, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20240371700
- Publication date Nov 7, 2024
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...
- Publication number 20240347610
- Publication date Oct 17, 2024
- Intel Corporation
- Koustav GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DR...
- Publication number 20240332302
- Publication date Oct 3, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION
- Publication number 20240332077
- Publication date Oct 3, 2024
- Intel Corporation
- Shaun MILLS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE
- Publication number 20240332175
- Publication date Oct 3, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...
- Publication number 20240332377
- Publication date Oct 3, 2024
- Intel Corporation
- Shaun MILLS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT ETCH BEFORE CAVITY SPACER FORMATION FOR BACKSIDE C...
- Publication number 20240332379
- Publication date Oct 3, 2024
- Intel Corporation
- Shaun Mills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING
- Publication number 20240332172
- Publication date Oct 3, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS

Ehren Mannebach

Person

Patents Grantslast 30 patents

Contact resistance reduction in transistor devices with metallizati...

Sideways vias in isolation areas to contact interior layers in stac...

Gate-all-around integrated circuit structures having depopulated ch...

Forming an oxide volume within a fin

Stacked source-drain-gate connection and process for forming such

Interconnect techniques for electrically connecting source/drain re...

Backside contacts for semiconductor devices

Epitaxial layer with substantially parallel sides

Leave-behind protective layer having secondary purpose

Stacked forksheet transistors

Sideways vias in isolation areas to contact interior layers in stac...

Stacked source-drain-gate connection and process for forming such

Stacked trigate transistors with dielectric isolation and process f...

Gate-all-around integrated circuit structures having depopulated ch...

Gate-all-around integrated circuit structures having depopulated ch...

Capacitance reduction for semiconductor devices based on wafer bonding

Device including air gapping of gate spacers and other dielectrics...

Gate-all-around integrated circuit structures having depopulated ch...

Forming an oxide volume within a fin

Interconnect techniques for electrically connecting source/drain re...

Stacked transistors having device strata with different channel widths

Vertically stacked memory elements with air gap

Forksheet transistor architectures

Stacked source-drain-gate connection and process for forming such

Techniques for forming gate structures for transistors arranged in...

Three dimensional integrated circuits with stacked transistors

Stacked trigate transistors with dielectric isolation between first...

Local interconnect with air gap

Stacked transistors with different gate lengths in different device...

Vertical memory cells

Patents Applicationslast 30 patents

CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...

INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED PENETRATIN...

INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-CUT BACKSIDE SOURCE OR...

INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...

BACKSIDE EPITAXIAL GROWTH FOR IMPROVED CONTACT AREA

FRONT SIDE AND BACKSIDE SOURCE OR DRAIN CONTACTS

INTEGRATED CIRCUIT STRUCTURE WITH ASYMMETRIC EPITAXIAL SOURCE OR DR...

DIRECTED SELF ASSEMBLY-ENABLED BACK-SIDE CONTACT ARRAYS ALIGNED TO...

TRANSISTORS WITH ASYMMETRIC SOURCE AND DRAIN CONTACTS

INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...

SELF-ALIGNED BACK-SIDE GATE VIAS

DOUBLE-SIDED DEVICE CONTACTS AND THROUGH VIAS FOR PERFORMANCE AND L...

RECESSED OXIDE AND SEAM-FIRST ETCH FOR AIR-GAPPED ISOLATION WALLS

AIR-GAPPED ISOLATION WALLS

BACKSIDE SOURCE/DRAIN TRANSISTOR CONTACT FLOW WITH SELECTIVE ETCH M...

INTEGRATED CIRCUIT STRUCTURE WITH DIFFERENTIATED SOURCE OR DRAIN ST...

INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE PLUG LAST APPROACH

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT REVEAL UNIFORMITY

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT STITCHING

BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES

CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DR...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION

BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...

BACKSIDE CONTACT ETCH BEFORE CAVITY SPACER FORMATION FOR BACKSIDE C...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING