Eiichi Hosomi

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,153,510
- Issue date Oct 6, 2015
- Kabushiki Kaisha Toshiba
- Masafumi Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor package
- Patent number 8,723,334
- Issue date May 13, 2014
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interface circuit and method of configuri...
- Patent number 8,183,599
- Issue date May 22, 2012
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interface circuit and method of configuri...
- Patent number 7,910,956
- Issue date Mar 22, 2011
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,960,494
- Issue date Nov 1, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,836,012
- Issue date Dec 28, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including memory unit and semiconductor module...
- Patent number 6,740,981
- Issue date May 25, 2004
- Kabushiki Kaisha, Toshiba
- Eiichi Hosomi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having bump electrodes and method of manufactu...
- Patent number 6,551,854
- Issue date Apr 22, 2003
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with improved thermal and mechanical charac...
- Patent number 6,469,373
- Issue date Oct 22, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type package for semiconductor device
- Patent number 6,376,907
- Issue date Apr 23, 2002
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 6,159,837
- Issue date Dec 12, 2000
- Kabushiki Kaisha Toshiba
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip connection type semiconductor integrated circuit device
- Patent number 6,111,317
- Issue date Aug 29, 2000
- Kabushiki Kaisha Toshiba
- Takashi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for inspecting an LSI device in an assembling...
- Patent number 6,061,466
- Issue date May 9, 2000
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device using gold bumps and copper leads as bonding e...
- Patent number 6,049,130
- Issue date Apr 11, 2000
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier and assembly structure thereof
- Patent number 5,825,081
- Issue date Oct 20, 1998
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting type semiconductor device
- Patent number 5,801,447
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bump electrode connected to an inner...
- Patent number 5,773,888
- Issue date Jun 30, 1998
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of fabricating the same and copper leads
- Patent number 5,747,881
- Issue date May 5, 1998
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising fine bump electrode having small si...
- Patent number 5,631,499
- Issue date May 20, 1997
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling bonding load of fine lead elec...
- Patent number 5,615,822
- Issue date Apr 1, 1997
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20160079216
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160079219
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140353810
- Publication date Dec 4, 2014
- KABUSHIKI KAISHA TOSHIBA
- Masafumi Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF FORMING A PACKAGED CHIP DEVICE AND...
- Publication number 20140246781
- Publication date Sep 4, 2014
- Kabushiki Kaisha Toshiba
- Eiichi HOSOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE
- Publication number 20140027930
- Publication date Jan 30, 2014
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERFACE CIRCUIT AND METHOD OF CONFIGURI...
- Publication number 20110133252
- Publication date Jun 9, 2011
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROD...
- Publication number 20110065239
- Publication date Mar 17, 2011
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERFACE CIRCUIT AND METHOD OF CONFIGURI...
- Publication number 20100096670
- Publication date Apr 22, 2010
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTERPOSER FORMED ON CHIP
- Publication number 20080105987
- Publication date May 8, 2008
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with interface circuit and method of configuri...
- Publication number 20060286754
- Publication date Dec 21, 2006
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20050051810
- Publication date Mar 10, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20020140095
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus and manufacturing method therefor
- Publication number 20010040280
- Publication date Nov 15, 2001
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including memory unit and semiconductor module...
- Publication number 20010028114
- Publication date Oct 11, 2001
- Kabushiki Kaisha Toshiba
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having bump electrodes and method of manufactu...
- Publication number 20010027007
- Publication date Oct 4, 2001
- Eiichi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS

Eiichi Hosomi

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Semiconductor device including semiconductor package

Semiconductor device with interface circuit and method of configuri...

Semiconductor device with interface circuit and method of configuri...

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor device including memory unit and semiconductor module...

Semiconductor device having bump electrodes and method of manufactu...

Semiconductor apparatus with improved thermal and mechanical charac...

Ball grid array type package for semiconductor device

Manufacturing method of semiconductor device

Flip-chip connection type semiconductor integrated circuit device

Apparatus and method for inspecting an LSI device in an assembling...

Semiconductor device using gold bumps and copper leads as bonding e...

Tape carrier and assembly structure thereof

Flip chip mounting type semiconductor device

Semiconductor device having a bump electrode connected to an inner...

Semiconductor device, method of fabricating the same and copper leads

Semiconductor device comprising fine bump electrode having small si...

Method and apparatus for controlling bonding load of fine lead elec...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF FORMING A PACKAGED CHIP DEVICE AND...

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH INTERFACE CIRCUIT AND METHOD OF CONFIGURI...

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PROD...

SEMICONDUCTOR DEVICE WITH INTERFACE CIRCUIT AND METHOD OF CONFIGURI...

SEMICONDUCTOR DEVICE HAVING INTERPOSER FORMED ON CHIP

Semiconductor device with interface circuit and method of configuri...

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor apparatus and manufacturing method therefor

Semiconductor device including memory unit and semiconductor module...

Semiconductor device having bump electrodes and method of manufactu...