Eiichi Kondoh

Person

Kai-Shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for selectively forming electric conductor and method for ma...
- Patent number 7,892,975
- Issue date Feb 22, 2011
- Semiconductor Technology Academic Research Center
- Eiichi Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 7,476,619
- Issue date Jan 13, 2009
- Tokyo Electron Limited
- Eiichi Kondoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making metal interconnection
- Patent number 6,063,703
- Issue date May 16, 2000
- Kawasaki Steel Corporation
- Hiroshi Shinriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnection and method for making
- Patent number 5,973,402
- Issue date Oct 26, 1999
- Kawasaki Steel Corporation
- Hiroshi Shinriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilevel interconnection structure
- Patent number 5,952,723
- Issue date Sep 14, 1999
- Kawasaki Steel Corporation
- Nobuyuki Takeyasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having multilevel inte...
- Patent number 5,637,534
- Issue date Jun 10, 1997
- Kawasaki Steel Corporation
- Nobuyuki Takeyasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making metal interconnection with chlorine plasma etch
- Patent number 5,627,102
- Issue date May 6, 1997
- Kawasaki Steel Corporation
- Hiroshi Shinriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for supplying liquid material and process for forming thin f...
- Patent number 5,552,181
- Issue date Sep 3, 1996
- Kawasaki Steel Corporation
- Eiichi Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical vapor deposition method for forming thin film
- Patent number 5,225,245
- Issue date Jul 6, 1993
- Kawasaki Steel Corporation
- Tomohiro Ohta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical vapor deposition apparatus for forming thin film
- Patent number 5,209,182
- Issue date May 11, 1993
- Kawasaki Steel Corporation
- Tomohiro Ohta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING COPPER-BASED FILM AND MATERIAL FOR FORMING COPPE...
- Publication number 20150211100
- Publication date Jul 30, 2015
- GAS-PHASE GROWTH LTD.
- Hideaki Machida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS OF FORMING ELECTROCONDUCTIVE SUBSTANCE AND METHOD OF FORM...
- Publication number 20140193573
- Publication date Jul 10, 2014
- FUJIKURA LTD.
- Eiichi KONDOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR FORMING CONDUCTOR, METHOD FOR FORMING CONDUCTOR, AND...
- Publication number 20100112776
- Publication date May 6, 2010
- Semiconductor Technology Academic Research Center
- Eiichi Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Adding Low-Pressure Gas Continuously to Supercirtical Flu...
- Publication number 20090003124
- Publication date Jan 1, 2009
- Eiichi Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR SELECTIVELY FORMING ELECTRIC CONDUCTOR AND METHOD FOR MA...
- Publication number 20080233705
- Publication date Sep 25, 2008
- Semiconductor Technology Academic Research Center
- Eiichi Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR FORMING CONDUCTOR, METHOD FOR FORMING CONDUCTOR, AND...
- Publication number 20080206949
- Publication date Aug 28, 2008
- Semiconductor Technology Academic Research Center
- Eiichi Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-PRESSURE PROCESSING APPARATUS
- Publication number 20070134602
- Publication date Jun 14, 2007
- Kenji Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device
- Publication number 20060154482
- Publication date Jul 13, 2006
- Eiichi Kondoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film deposition method
- Publication number 20060121307
- Publication date Jun 8, 2006
- TOKYO ELECTRON LIMITED
- Koumei Matsuzawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Deposition method
- Publication number 20060099348
- Publication date May 11, 2006
- TOKYO ELECTRON LIMITED
- Masaki Narushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film formation method
- Publication number 20060084266
- Publication date Apr 20, 2006
- TOKYO ELECTRON LIMITED
- Masaki Narushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate processing method, semiconductor device production method...
- Publication number 20050260846
- Publication date Nov 24, 2005
- Eiichi Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Deposition apparatus and a deposition method using medium in a supe...
- Publication number 20050158477
- Publication date Jul 21, 2005
- TOKYO ELECTRON LIMITED
- Vincent Vezin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Eiichi Kondoh

Person

Patents Grantslast 30 patents

Method for selectively forming electric conductor and method for ma...

Semiconductor device

Method for making metal interconnection

Metal interconnection and method for making

Semiconductor device having a multilevel interconnection structure

Method of manufacturing semiconductor device having multilevel inte...

Method for making metal interconnection with chlorine plasma etch

Method for supplying liquid material and process for forming thin f...

Chemical vapor deposition method for forming thin film

Chemical vapor deposition apparatus for forming thin film

Patents Applicationslast 30 patents

METHOD FOR FORMING COPPER-BASED FILM AND MATERIAL FOR FORMING COPPE...

APPARATUS OF FORMING ELECTROCONDUCTIVE SUBSTANCE AND METHOD OF FORM...

APPARATUS FOR FORMING CONDUCTOR, METHOD FOR FORMING CONDUCTOR, AND...

Method of Adding Low-Pressure Gas Continuously to Supercirtical Flu...

METHOD FOR SELECTIVELY FORMING ELECTRIC CONDUCTOR AND METHOD FOR MA...

APPARATUS FOR FORMING CONDUCTOR, METHOD FOR FORMING CONDUCTOR, AND...

HIGH-PRESSURE PROCESSING APPARATUS

Semiconductor device

Film deposition method

Deposition method

Film formation method

Substrate processing method, semiconductor device production method...

Deposition apparatus and a deposition method using medium in a supe...