Eiji HASHINO

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder bump bonding structure
- Patent number 8,847,390
- Issue date Sep 30, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Eiji Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball mounting method and apparatus
- Patent number 8,104,663
- Issue date Jan 31, 2012
- Nippon Steel Materials Co., Ltd.
- Shinji Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CMP conditioner, method for arranging hard abrasive grains for use...
- Patent number 7,465,217
- Issue date Dec 16, 2008
- Nippon Steel Corporation
- Toshiya Kinoshita
- B24 - GRINDING POLISHING
Information Patent Grant
Ball transferring method and apparatus
- Patent number 7,285,486
- Issue date Oct 23, 2007
- Nippon Steel Materials Co., Ltd.
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor devices provided with low me...
- Patent number 7,045,389
- Issue date May 16, 2006
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with low melting point metal bumps
- Patent number 7,045,388
- Issue date May 16, 2006
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball transferring method and apparatus
- Patent number 6,916,731
- Issue date Jul 12, 2005
- Nippon Steel Corporation
- Kenji Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spherical semiconductor device and method for fabricating the same
- Patent number 6,909,182
- Issue date Jun 21, 2005
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of partially plating substrate for electronic devices
- Patent number 6,884,708
- Issue date Apr 26, 2005
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-arranging substrate for forming bump, ball-arranging head, bal...
- Patent number 6,571,007
- Issue date May 27, 2003
- Nippon Steel Corporation
- Kenji Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spherical semiconductor device and method for fabricating the same
- Patent number 6,509,645
- Issue date Jan 21, 2003
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer of flux onto electrodes and production of bumps on electrodes
- Patent number 5,899,376
- Issue date May 4, 1999
- Nippon Steel Corporation
- Kouhei Tatumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production of small metal bumps
- Patent number 5,765,744
- Issue date Jun 16, 1998
- Nippon Steel Corporation
- Kouhei Tatumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE
- Publication number 20140109962
- Publication date Apr 24, 2014
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Takayuki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER BUMP BONDING STRUCTURE
- Publication number 20140054766
- Publication date Feb 27, 2014
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Eiji HASHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLEC...
- Publication number 20110107580
- Publication date May 12, 2011
- Shinji Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL MOUNTING METHOD AND APPARATUS
- Publication number 20100127049
- Publication date May 27, 2010
- Shinji Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball transferring method and apparatus
- Publication number 20080032495
- Publication date Feb 7, 2008
- Nippon Steel Materials Co., Ltd.
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CMP conditioner, method for arranging hard abrasive grains for use...
- Publication number 20060160477
- Publication date Jul 20, 2006
- NIPPON STEEL CORPORATION
- Toshiya Kinoshita
- B24 - GRINDING POLISHING
Information Patent Application
Ball transferring method and apparatus
- Publication number 20050176176
- Publication date Aug 11, 2005
- NIPPON STEEL CORPORATION
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cmp conditioner, method for arranging rigid grains used for cmp con...
- Publication number 20040072510
- Publication date Apr 15, 2004
- Toshiya Kinoshita
- B24 - GRINDING POLISHING
Information Patent Application
SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20040061224
- Publication date Apr 1, 2004
- NIPPON STEEL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spherical semiconductor device and method for fabricating the same
- Publication number 20030020164
- Publication date Jan 30, 2003
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball transferring method and apparatus
- Publication number 20020137324
- Publication date Sep 26, 2002
- Kenji Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spherical semiconductor device and method for fabricating the same
- Publication number 20020132462
- Publication date Sep 19, 2002
- NIPPON STEEL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS
- Publication number 20020036344
- Publication date Mar 28, 2002
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20020011665
- Publication date Jan 31, 2002
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES
- Publication number 20010012683
- Publication date Aug 9, 2001
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS

Eiji HASHINO

Person

Patents Grantslast 30 patents

Lead-free solder bump bonding structure

Solder ball mounting method and apparatus

CMP conditioner, method for arranging hard abrasive grains for use...

Ball transferring method and apparatus

Method for fabricating a semiconductor devices provided with low me...

Semiconductor device provided with low melting point metal bumps

Ball transferring method and apparatus

Spherical semiconductor device and method for fabricating the same

Method of partially plating substrate for electronic devices

Ball-arranging substrate for forming bump, ball-arranging head, bal...

Spherical semiconductor device and method for fabricating the same

Transfer of flux onto electrodes and production of bumps on electrodes

Production of small metal bumps

Patents Applicationslast 30 patents

INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE

LEAD-FREE SOLDER BUMP BONDING STRUCTURE

MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLEC...

SOLDER BALL MOUNTING METHOD AND APPARATUS

Ball transferring method and apparatus

CMP conditioner, method for arranging hard abrasive grains for use...

Ball transferring method and apparatus

Cmp conditioner, method for arranging rigid grains used for cmp con...

SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Spherical semiconductor device and method for fabricating the same

Ball transferring method and apparatus

Spherical semiconductor device and method for fabricating the same

SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS

SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES