Eiji Mugiya

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit module and method of producing the same
- Patent number 9,807,916
- Issue date Oct 31, 2017
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and method of manufacturing same
- Patent number 9,560,740
- Issue date Jan 31, 2017
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and method of producing circuit module
- Patent number 9,456,488
- Issue date Sep 27, 2016
- Taiyo Yuden Co., Ltd.
- Masaya Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and production method therefor
- Patent number 9,455,209
- Issue date Sep 27, 2016
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module having electrical shield
- Patent number 9,101,050
- Issue date Aug 4, 2015
- Taiyo Yuden Co., Ltd.
- Masaya Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and method of producing the same
- Patent number 9,101,044
- Issue date Aug 4, 2015
- Taiyo Yuden Co., Ltd.
- Masaya Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module
- Patent number 9,055,682
- Issue date Jun 9, 2015
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and method of producing circuit module
- Patent number 9,018,039
- Issue date Apr 28, 2015
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module
- Patent number 8,897,019
- Issue date Nov 25, 2014
- Taiyo Yuden Co., Ltd.
- Masaya Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and method of producing circuit module
- Patent number 8,890,309
- Issue date Nov 18, 2014
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with built-in electronic component
- Patent number 8,536,959
- Issue date Sep 17, 2013
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer board incorporating electronic component and method for...
- Patent number 8,314,343
- Issue date Nov 20, 2012
- Taiyo Yuden Co., Ltd.
- Yusuke Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME
- Publication number 20160095267
- Publication date Mar 31, 2016
- Taiyo Yuden Co., Ltd.
- Kenzo KITAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
- Publication number 20150070849
- Publication date Mar 12, 2015
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20150070851
- Publication date Mar 12, 2015
- Taiyo Yuden Co., Ltd.
- Kenzo KITAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20150062835
- Publication date Mar 5, 2015
- Taiyo Yuden Co., Ltd.
- Takehiko KAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20150049439
- Publication date Feb 19, 2015
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
- Publication number 20150043172
- Publication date Feb 12, 2015
- Taiyo Yuden Co., Ltd.
- Eiji MUGIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20150043171
- Publication date Feb 12, 2015
- Taiyo Yuden Co., Ltd.
- Eiji MUGIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
- Publication number 20150044822
- Publication date Feb 12, 2015
- Taiyo Yuden Co., Ltd.
- Eiji MUGIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20150043189
- Publication date Feb 12, 2015
- Taiyo Yuden Co., Ltd.
- Kenzo KITAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20150043170
- Publication date Feb 12, 2015
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20150016066
- Publication date Jan 15, 2015
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR
- Publication number 20140293550
- Publication date Oct 2, 2014
- Taiyo Yuden Co., Ltd.
- Eiji MUGIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- Publication number 20140049928
- Publication date Feb 20, 2014
- Taiyo Yuden Co., Ltd.
- Tatsuro Sawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130271928
- Publication date Oct 17, 2013
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BOARD INCORPORATING ELECTRONIC COMPONENT AND METHOD FOR...
- Publication number 20090084596
- Publication date Apr 2, 2009
- Taiyo Yuden Co., Ltd.
- Yusuke INOUE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and unit equipped with the same
- Publication number 20060186519
- Publication date Aug 24, 2006
- Taizo Inoue
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Eiji Mugiya

Person

Patents Grantslast 30 patents

Circuit module and method of producing the same

Circuit module and method of manufacturing same

Circuit module and method of producing circuit module

Circuit module and production method therefor

Circuit module having electrical shield

Circuit module and method of producing the same

Circuit module

Circuit module and method of producing circuit module

Circuit module

Circuit module and method of producing circuit module

Substrate with built-in electronic component

Multi-layer board incorporating electronic component and method for...

Patents Applicationslast 30 patents

CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME

CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

CIRCUIT MODULE

CIRCUIT MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE

CIRCUIT MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME

MULTI-LAYER BOARD INCORPORATING ELECTRONIC COMPONENT AND METHOD FOR...

Semiconductor device and unit equipped with the same