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Eiji Nakamura

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION
    • Publication number 20230241700
    • Publication date Aug 3, 2023
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SURFACE-COATED CUTTING TOOL
    • Publication number 20230105932
    • Publication date Apr 6, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Eiji Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION
    • Publication number 20220193805
    • Publication date Jun 23, 2022
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHEMICAL REACTION NETWORK FOR PROCESSING CONCENTRATION OF CHEMICAL...
    • Publication number 20220064700
    • Publication date Mar 3, 2022
    • International Business Machines Corporation
    • Eiji Nakamura
    • C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
  • Information Patent Application

    FORMING OF BUMP STRUCTURE
    • Publication number 20210125950
    • Publication date Apr 29, 2021
    • International Business Machines Corporation
    • Takashi Hisada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EFFICIENT ASSEMBLY OF OLIGONUCLEOTIDES FOR NUCLEIC ACID BASED DATA...
    • Publication number 20200387769
    • Publication date Dec 10, 2020
    • International Business Machines Corporation
    • Koji Masuda
    • C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
  • Information Patent Application

    PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION
    • Publication number 20200361013
    • Publication date Nov 19, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ASSEMBLING OF CHIPS BY STACKING WITH ROTATION
    • Publication number 20200227400
    • Publication date Jul 16, 2020
    • International Business Machines Corporation
    • Takashi Hisada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
    • Publication number 20200150361
    • Publication date May 14, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
    • Publication number 20200150362
    • Publication date May 14, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20200152590
    • Publication date May 14, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
    • Publication number 20200075522
    • Publication date Mar 5, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20200058612
    • Publication date Feb 20, 2020
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    REDUCTION OF STRESS IN VIA STRUCTURE
    • Publication number 20190214339
    • Publication date Jul 11, 2019
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
    • Publication number 20190131266
    • Publication date May 2, 2019
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING SOLDER BUMPS
    • Publication number 20180374812
    • Publication date Dec 27, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCTION OF STRESS IN VIA STRUCTURE
    • Publication number 20180294214
    • Publication date Oct 11, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCTION OF STRESS IN VIA STRUCTURE
    • Publication number 20180294213
    • Publication date Oct 11, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INJECTION MOLDED SOLDER BUMPING
    • Publication number 20180277509
    • Publication date Sep 27, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
    • Publication number 20180269173
    • Publication date Sep 20, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
    • Publication number 20180108631
    • Publication date Apr 19, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
    • Publication number 20180108630
    • Publication date Apr 19, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING SOLDER BUMPS
    • Publication number 20180076165
    • Publication date Mar 15, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING SOLDER BUMPS
    • Publication number 20180076164
    • Publication date Mar 15, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING SOLDER BUMPS
    • Publication number 20180076163
    • Publication date Mar 15, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20180061796
    • Publication date Mar 1, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING A SOLDER BUMP STRUCTURE
    • Publication number 20180061797
    • Publication date Mar 1, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Body Composition Measuring Apparatus
    • Publication number 20140378860
    • Publication date Dec 25, 2014
    • TANITA CORPORATION
    • Eiji Nakamura
    • G01 - MEASURING TESTING
  • Information Patent Application

    Tire
    • Publication number 20050250883
    • Publication date Nov 10, 2005
    • Bridgestone Corporation
    • Tadashi Shibata
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    Cleaning sheet
    • Publication number 20030068967
    • Publication date Apr 10, 2003
    • Eiji Nakamura
    • A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...