Eiji Takai

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroless copper plating solution, electroless copper plating pro...
- Patent number 7,169,216
- Issue date Jan 30, 2007
- Hitachi, Ltd.
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a wiring substrate and an electroless coppe...
- Patent number 6,989,329
- Issue date Jan 24, 2006
- Hitachi, Ltd.
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating machine, and multi-layer printed wiring...
- Patent number 6,900,394
- Issue date May 31, 2005
- Hitachi, Ltd.
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and an electroless copper plating solution for pro...
- Patent number 6,831,009
- Issue date Dec 14, 2004
- Hitachi, Ltd.
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution, electroless copper plating pro...
- Patent number 6,805,915
- Issue date Oct 19, 2004
- Hitachi, Ltd.
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Electroless copper plating solution, electroless copper plating pro...
- Publication number 20070079727
- Publication date Apr 12, 2007
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless copper plating machine thereof, and multi-layer printed...
- Publication number 20050252684
- Publication date Nov 17, 2005
- Takeyiki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless copper plating solution, electroless copper plating pro...
- Publication number 20050079280
- Publication date Apr 14, 2005
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing a wiring substrate and an electroless coppe...
- Publication number 20050042366
- Publication date Feb 24, 2005
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless copper plating solution, electroless copper plating pro...
- Publication number 20030054094
- Publication date Mar 20, 2003
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wiring substrate and manufacturing method of the same along with el...
- Publication number 20020064947
- Publication date May 30, 2002
- Takeyuki Itabashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Electroless copper plating solution, electroless copper plating pro...

Method of manufacturing a wiring substrate and an electroless coppe...

Electroless copper plating machine, and multi-layer printed wiring...

Wiring substrate and an electroless copper plating solution for pro...

Electroless copper plating solution, electroless copper plating pro...

Patents Applicationslast 30 patents

Electroless copper plating solution, electroless copper plating pro...

Electroless copper plating machine thereof, and multi-layer printed...

Electroless copper plating solution, electroless copper plating pro...

Method of manufacturing a wiring substrate and an electroless coppe...

Electroless copper plating solution, electroless copper plating pro...

Wiring substrate and manufacturing method of the same along with el...