Ekgachai Kenganantanon

Person

Muangchacherngsao Chacherngsao, TH

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a surface-mount integrated circuit package with s...
- Patent number 11,887,864
- Issue date Jan 30, 2024
- Microchip Technology Incorporated
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with electrical routing improvements...
- Patent number 11,145,574
- Issue date Oct 12, 2021
- Microchip Technology Incorporated
- Oliver Mabutas
- G01 - MEASURING TESTING
Information Patent Grant
Wafer mapping process control with indicator line
- Patent number 9,263,397
- Issue date Feb 16, 2016
- Microchip Technology Incorporated
- Matthew Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die attachment method using non-conductive screen pri...
- Patent number 7,927,921
- Issue date Apr 19, 2011
- Microchip Technology Incorporated
- Ekgachai Kenganantanon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...
- Publication number 20220344173
- Publication date Oct 27, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Wichai Kovitsophon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICAL ROUTING IMPROVEMENTS...
- Publication number 20200135620
- Publication date Apr 30, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Oliver Mabutas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Down Bond in Semiconductor Devices
- Publication number 20190221502
- Publication date Jul 18, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Joseph Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Leads Package With Improved Contact Pins
- Publication number 20170005030
- Publication date Jan 5, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEADS PACKAGE WITH IMPROVED CONTACT PINS
- Publication number 20160148876
- Publication date May 26, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Rangsun Kitnarong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Treating A Leadframe Surface And Device Having A Treated...
- Publication number 20150187688
- Publication date Jul 2, 2015
- MICROCHIP TECHNOLOGY INCORPORATED
- Joseph D. Fernandez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Mapping Process Control with Indicator Line
- Publication number 20140264962
- Publication date Sep 18, 2014
- Matthew Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONVENTIONAL METHOD OF SILICON WAFER SAWING USING A PLURALITY O...
- Publication number 20140235033
- Publication date Aug 21, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Bunker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Attachment Method Using Non-Conductive Screen Pri...
- Publication number 20100304532
- Publication date Dec 2, 2010
- MICROCHIP TECHNOLOGY INCORPORATED
- Ekgachai Kenganantanon
- H01 - BASIC ELECTRIC ELEMENTS

Ekgachai Kenganantanon

Person

Patents Grantslast 30 patents

Method of forming a surface-mount integrated circuit package with s...

Semiconductor device packages with electrical routing improvements...

Wafer mapping process control with indicator line

Semiconductor die attachment method using non-conductive screen pri...

Patents Applicationslast 30 patents

METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH S...

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICAL ROUTING IMPROVEMENTS...

Down Bond in Semiconductor Devices

Flat No-Leads Package With Improved Contact Pins

FLAT NO-LEADS PACKAGE WITH IMPROVED CONTACT PINS

Method For Treating A Leadframe Surface And Device Having A Treated...

Wafer Mapping Process Control with Indicator Line

NON-CONVENTIONAL METHOD OF SILICON WAFER SAWING USING A PLURALITY O...

Semiconductor Die Attachment Method Using Non-Conductive Screen Pri...