Ekta Misra

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled-stress-alleviating pad structure
- Patent number 10,096,557
- Issue date Oct 9, 2018
- GLOBALFOUNDRIES Inc.
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled-stress-alleviating pad structure
- Patent number 9,842,810
- Issue date Dec 12, 2017
- GLOBALFOUNDRIES Inc.
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 9,754,905
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug via formation with grid features in the passivation layer
- Patent number 9,633,962
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial solder bump support structure
- Patent number 9,431,359
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including passivation layer encapsulant
- Patent number 9,214,385
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug via formation by patterned plating and polishing
- Patent number 9,159,696
- Issue date Oct 13, 2015
- GLOBALFOUNDRIES, INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Far back end of the line metallization method and structures
- Patent number 8,937,009
- Issue date Jan 20, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump connections
- Patent number 8,778,792
- Issue date Jul 15, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial solder bump support structure
- Patent number 8,563,416
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Brian Michael Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump connections
- Patent number 8,492,892
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer extension to chip edge
- Patent number 8,299,581
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset solder vias, methods of manufacturing and design structures
- Patent number 8,298,929
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION
- Publication number 20180108626
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILED-STRESS-ALLEVIATING PAD STRUCTURE
- Publication number 20180061777
- Publication date Mar 1, 2018
- GLOBALFOUNDRIES INC.
- Ekta MISRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILED-STRESS-ALLEVIATING PAD STRUCTURE
- Publication number 20170358541
- Publication date Dec 14, 2017
- GLOBALFOUNDRIES INC.
- Ekta MISRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT
- Publication number 20160035641
- Publication date Feb 4, 2016
- GLOBALFOUNDRIES INC.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLATING WITHOUT PHOTORESIST
- Publication number 20150348910
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING
- Publication number 20150325540
- Publication date Nov 12, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLATING WITHOUT PHOTORESIST
- Publication number 20150311161
- Publication date Oct 29, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG VIA FORMATION WITH GRID FEATURES IN THE PASSIVATION LAYER
- Publication number 20150097283
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING
- Publication number 20150076688
- Publication date Mar 19, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES
- Publication number 20140319522
- Publication date Oct 30, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT
- Publication number 20140183757
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SOLDER BUMP SUPPORT STRUCTURE
- Publication number 20130320528
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP CONNECTIONS
- Publication number 20130140695
- Publication date Jun 6, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SOLDER BUMP SUPPORT STRUCTURE
- Publication number 20130026624
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Brian Michael Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP CONNECTIONS
- Publication number 20120146212
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
- Publication number 20120139123
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASSIVATION LAYER EXTENSION TO CHIP EDGE
- Publication number 20110298095
- Publication date Dec 8, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Final passivation for wafer level warpage and ULK stress reduction

Tiled-stress-alleviating pad structure

Tiled-stress-alleviating pad structure

Final passivation for wafer level warpage and ULK stress reduction

Plug via formation with grid features in the passivation layer

Coaxial solder bump support structure

Semiconductor device including passivation layer encapsulant

Plug via formation by patterned plating and polishing

Far back end of the line metallization method and structures

Solder bump connections

Structures and methods to reduce maximum current density in a solde...

Coaxial solder bump support structure

Solder bump connections

Structures and methods to reduce maximum current density in a solde...

Passivation layer extension to chip edge

Offset solder vias, methods of manufacturing and design structures

Patents Applicationslast 30 patents

FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION

TILED-STRESS-ALLEVIATING PAD STRUCTURE

TILED-STRESS-ALLEVIATING PAD STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT

SELECTIVE PLATING WITHOUT PHOTORESIST

PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING

SELECTIVE PLATING WITHOUT PHOTORESIST

PLUG VIA FORMATION WITH GRID FEATURES IN THE PASSIVATION LAYER

PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING

FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES

SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT

COAXIAL SOLDER BUMP SUPPORT STRUCTURE

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

SOLDER BUMP CONNECTIONS

COAXIAL SOLDER BUMP SUPPORT STRUCTURE

SOLDER BUMP CONNECTIONS

OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES

PASSIVATION LAYER EXTENSION TO CHIP EDGE

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...