Eleanor P. Rabadam

Person

Folsom, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stepped electronic substrate for integrated circuit packages
- Patent number 12,165,983
- Issue date Dec 10, 2024
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lower profile package with power supply in package
- Patent number 6,812,566
- Issue date Nov 2, 2004
- Intel Corporation
- Eleanor P. Rabadam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...
- Publication number 20230318247
- Publication date Oct 5, 2023
- Intel Corporation
- Eleanor Patricia Paras RABADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE
- Publication number 20230207412
- Publication date Jun 29, 2023
- Intel Corporation
- Ronald SPREITZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER INTERCONNECTS AND ENCLOSURE FOR SILICON PHOTONICS LIDAR...
- Publication number 20230197699
- Publication date Jun 22, 2023
- Ronald L. Spreitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS
- Publication number 20220404474
- Publication date Dec 22, 2022
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- G02 - OPTICS
Information Patent Application
ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE
- Publication number 20220390562
- Publication date Dec 8, 2022
- Guiyun Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE VOID FILLING FOR AN INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20220181294
- Publication date Jun 9, 2022
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED ELECTRONIC SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20220051986
- Publication date Feb 17, 2022
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for a non-volatile memory device including integrated passi...
- Publication number 20040026715
- Publication date Feb 12, 2004
- Eleanor P. Rabadam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory device packaging including stacked passive devices and metho...
- Publication number 20030122216
- Publication date Jul 3, 2003
- Eleanor P. Rabadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for a non-volatile memory device including integrated passi...
- Publication number 20030122173
- Publication date Jul 3, 2003
- Eleanor P. Rabadam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lower profile package with power supply in package
- Publication number 20030123239
- Publication date Jul 3, 2003
- Eleanor P. Rabadam
- H01 - BASIC ELECTRIC ELEMENTS

Eleanor P. Rabadam

Person

Patents Grantslast 30 patents

Stepped electronic substrate for integrated circuit packages

Lower profile package with power supply in package

Patents Applicationslast 30 patents

PACKAGE WITH MULTIPLE PHOTONIC INTEGRATED CIRCUIT DIES OPTICALLY CO...

TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE

INTERPOSER INTERCONNECTS AND ENCLOSURE FOR SILICON PHOTONICS LIDAR...

SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS

ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE

THROUGH-SUBSTRATE VOID FILLING FOR AN INTEGRATED CIRCUIT ASSEMBLY

STEPPED ELECTRONIC SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGES

Package for a non-volatile memory device including integrated passi...

Memory device packaging including stacked passive devices and metho...

Package for a non-volatile memory device including integrated passi...

Lower profile package with power supply in package