Elizabeth G. Jacobs

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Richardson, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device protective overcoat with enhanced adhesion to...
- Patent number 6,787,397
- Issue date Sep 7, 2004
- Texas Instruments Incorporated
- Leland S. Swanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-scale assembly of chip-size packages
- Patent number 6,730,541
- Issue date May 4, 2004
- Texas Instruments Incorporated
- Katherine G. Heinen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device protective overcoat with enhanced adhesion to...
- Patent number 6,580,170
- Issue date Jun 17, 2003
- Texas Instruments Incorporated
- Leland S. Swanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief matrix for integrated circuit packaging
- Patent number 6,096,578
- Issue date Aug 1, 2000
- Texas Instruments Incorporated
- Elizabeth G. Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief matrix for integrated circuit packaging
- Patent number 5,894,173
- Issue date Apr 13, 1999
- Texas Instruments Incorporated
- Elizabeth G. Jacobs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device protective overcoat with enhanced adhesion to...
- Publication number 20030205812
- Publication date Nov 6, 2003
- Leland S. Swanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device protective overcoat with enhanced adhesion to...
- Publication number 20020011656
- Publication date Jan 31, 2002
- Leland S. Swanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-SCALE ASSEMBY OF CHIP-SIZE PACKAGES
- Publication number 20010044197
- Publication date Nov 22, 2001
- KATHERINE G. HEINEN
- H01 - BASIC ELECTRIC ELEMENTS