Emery E. Frey

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Removable and low insertion force connector system
- Patent number 12,219,706
- Issue date Feb 4, 2025
- Intel Corporation
- Jonathan W. Thibado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System device aggregation in a liquid cooling environment
- Patent number 12,082,370
- Issue date Sep 3, 2024
- Intel Corporation
- Aaron Gorius
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System to reduce coolant use in an array of circuit boards
- Patent number 11,184,997
- Issue date Nov 23, 2021
- Intel Corporation
- Joseph Andrew Broderick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat exchanger methods, apparatuses and systems with a manifold str...
- Patent number 9,721,871
- Issue date Aug 1, 2017
- Intel Corporation
- Emery E. Frey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROTRUSIONS OF SOCKET BODIES HAVING METAL
- Publication number 20250024622
- Publication date Jan 16, 2025
- Intel Corporation
- Richard Canham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERS FOR INTEGRATED CIRCUIT PACKAGE SOCKETS
- Publication number 20240407092
- Publication date Dec 5, 2024
- Intel Corporation
- Ariatne Ramirez Macias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS
- Publication number 20220336322
- Publication date Oct 20, 2022
- Intel Corporation
- Juha T. Paavola
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REMOVABLE AND LOW INSERTION FORCE CONNECTOR SYSTEM
- Publication number 20210400813
- Publication date Dec 23, 2021
- Intel Corporation
- Jonathan W. THIBADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM DEVICE AGGREGATION IN A LIQUID COOLING ENVIRONMENT
- Publication number 20210385971
- Publication date Dec 9, 2021
- Intel Corporation
- Aaron GORIUS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE
- Publication number 20210120663
- Publication date Apr 22, 2021
- Intel Corporation
- Jonathan W. THIBADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM TO REDUCE COOLANT USE IN AN ARRAY OF CIRCUIT BOARDS
- Publication number 20190045661
- Publication date Feb 7, 2019
- Intel Corporation
- Joseph Andrew Broderick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING INTERFACE FOR FIELD REPLACEABLE ELECTRONIC COMPONENT
- Publication number 20180059744
- Publication date Mar 1, 2018
- Intel Corporation
- MICHAEL S. BRAZEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT EXCHANGER PUCK
- Publication number 20180058777
- Publication date Mar 1, 2018
- Intel Corporation
- AARON P. ANDERSON
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT EXCHANGER METHODS, APPARATUSES AND SYSTEMS WITH A MANIFOLD STR...
- Publication number 20170162475
- Publication date Jun 8, 2017
- Intel Corporation
- Emery E. Frey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Emery E. Frey

Person

Patents Grantslast 30 patents

Removable and low insertion force connector system

System device aggregation in a liquid cooling environment

System to reduce coolant use in an array of circuit boards

Heat exchanger methods, apparatuses and systems with a manifold str...

Patents Applicationslast 30 patents

PROTRUSIONS OF SOCKET BODIES HAVING METAL

COVERS FOR INTEGRATED CIRCUIT PACKAGE SOCKETS

TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS

REMOVABLE AND LOW INSERTION FORCE CONNECTOR SYSTEM

SYSTEM DEVICE AGGREGATION IN A LIQUID COOLING ENVIRONMENT

DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE

SYSTEM TO REDUCE COOLANT USE IN AN ARRAY OF CIRCUIT BOARDS

LIQUID COOLING INTERFACE FOR FIELD REPLACEABLE ELECTRONIC COMPONENT

HEAT EXCHANGER PUCK

HEAT EXCHANGER METHODS, APPARATUSES AND SYSTEMS WITH A MANIFOLD STR...